The invention relates to a
chip sealing defect detection method based on a YOLO
algorithm and a
chip field fine-tuning
large model, and belongs to the field of defect detection and
computer vision. According to the method, an
image enhancement module is designed, an original fuzzy or low-contrast
chip image is enhanced, and the identification degree of chip surface defect key features is effectively improved through self-adaptive contrast stretching and detail
sharpening processing; according to the method, a YOLO series model is deployed at the edge end, and real-time detection and type judgment of chip surface defects are achieved. For different defect categories, two
processing flows are adopted: for the elargol covering defect, firstly, a YOLO
image segmentation lightweight model is used for segmenting an elargol region and a chip region to obtain a corresponding
mask; and then calculating the elargol coverage rate based on the
mask, and judging whether the elargol coverage rate is insufficient or not. For cavity / crack defects on the surface of the chip, firstly, the YOLO target detection model is used for carrying out preliminary detection and positioning on obviously abnormal defects; and the candidate frames with
low confidence coefficient and unclear boundaries are submitted to a defect detection
large model which is finely adjusted in the chip field for re-checking and refined discrimination. And finally outputting a defect category and coordinate information of the defect category in the image. According to the method, through efficient YOLO target detection and a chip field fine-tuning
large model, rapid and accurate chip sealing detection defect identification can be realized, the automatic detection level of a chip
production line is improved, the error rate of manual detection is reduced, and the production efficiency and the product quality are remarkably improved.