The present application relates to the technical field of electronic manufacturing
visual detection, in particular to a circuit board
welding fault identification method and
system based on
machine vision, the method comprising: receiving a
welding area image and completing gray scale conversion,
Gaussian filtering and adaptive threshold segmentation, and extracting a solder joint binary
mask. The geometric shape parameters of the solder joint are calculated, the ideal state category is judged through a
welding state
inference model, the
deviation vector is obtained by comparing the ideal state and the actual parameters, and the state inversion calculation is started. The process calls a solder flowability physical
simulation engine, simulates the solder spreading behavior based on temperature field and pad
layout data, iteratively adjusts the
surface tension coefficient and
wetting angle parameters, and matches the
simulation morphology and the actual morphology until the matching parameters are mapped as the welding fault type. The present application improves the attribution accuracy of circuit board welding fault identification through physical cause inversion and
simulation parameter iterative matching.