The invention discloses a high-precision
laser hole overlapped abutting joint method for producing a circuit board, belonging to the technical field of production of circuit boards. The technical key points in the invention comprise the following steps of: (1), manufacturing a circuit target on an inner core plate; (2), respectively and sequentially pressing a semi-solidified sheet and a
copper foil on two side plate surfaces of the inner core plate,
punching a first through hole, and then, sequentially performing
copper inhibiting and brownification treatment; (3), burning to form a second through hole corresponding to the circuit target on the semi-solidified sheet and the
copper foil through
laser by taking the first through hole as a positioning coordinate; (4), manufacturing
laser holes on a single panel by taking the circuit target as a reference coordinate when laser
punching is carried out; and (5), repeating the step (2) to the step (4), manufacturing the laser holes layer by layer always by taking the circuit target on the inner core plate as the reference coordinate, and finally, manufacturing multi-stage any-layer
interconnection plates. The high-precision laser hole overlapped abutting joint method for producing the circuit board provided by the invention is high in
processing efficiency, low in cost and simple and convenient to operate; and the high-precision laser hole overlapped abutting joint method is used for producing the circuit board.