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This invention relates to the field of in-situ monitoring technology for semiconductor thin film growth and etching processes, and discloses an in-situ laser interferometry thickness monitoring method and apparatus for low-rate epitaxy processes. The invention acquires the reflected light intensity signal of the target thin film and obtains the dynamic envelope function of the reflected light intensity signal under the current measurement conditions. When the reflected light intensity signal is in the middle phase region of the dynamic envelope function, the low-rate etching or low-rate growth stage to be measured is entered. During the low-rate etching or low-rate growth stage, the original thickness sequence is obtained. Based on the monotonic physical constraint of film thickness change, the true thickness curve of the target thin film is obtained. Under low-rate epitaxy conditions, this invention achieves continuous thickness measurement and rate extraction when the film thickness change is less than one complete oscillation cycle through dynamic envelope inversion and monotonic physical constraint recovery.

This invention discloses an improved circuit structure for a USB-C interface device. The structure includes a CPU, a USB-C protocol chip, a USB-C connector, a non-standard detection circuit module, and a power switch SW1. The USB-C protocol chip determines whether the insertion / removal is in master or slave mode by detecting the voltages CC1 and CC2 in the USB-C connector, and communicates with the CPU via an I2C signal bus. After a non-standard USB-C cable is inserted, the non-standard detection circuit module provides additional logic for determining the voltages CC1 and CC2 in the USB-C connector and outputs a non-standard detection control signal to control the opening and closing of the power switch SW1. This structure allows non-standard USB-C cables to be recognized by the USB-C protocol chip just like standard USB-C cables, avoiding the need for customers to remember which specific terminal devices these outwardly identical but internally incompatible USB-C cables can only be used with.