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109 results about "Test vector generation" patented technology

Method for establishing large-scale network chip verification platform

The invention relates to a method for establishing a large-scale network chip verification platform. The method comprises the following steps of: firstly, establishing a control text document, and then writing an initial function of a random function library, and writing a calling function of the random function library; secondly, establishing a module-level function verification platform, comprising the following steps of: generating a top-level module of the module-level function verification platform, establishing a clock generating module and a reset generating module, establishing an interface signal module, establishing a test vector generating module, establishing a register configuring module and establishing a reference model module of a tested module; and thirdly, establishing a chip-level function verification platform, comprising the following steps of: generating a top-level module of the chip-level function verification platform, multiplexing the clock generating module, the rest module, the interface signal module, the test vector generating module, the register configuring module and the reference model module of the module-level function verification platform, and establishing a CPU simulation model. The method has a strong function, high efficiency, stability and simple structure. By means of the invention, the time for setting up the network chip verification platform can be greatly shortened and the stimulation efficiency can be improved.
Owner:丁贤根

An Automatic Test Vector Generation Method Based on Generalized Folding Sets

An automatic test vector generation method based on a general folding set comprises the following steps of: firstly, classifying faults into faults easy to test and faults difficult to test through random tests, merging the faults difficult to test, dividing the number of the faults difficult to test which can be tested by using the same test vector into groups, selecting two groups of faults having the maximal number of faults capable of being merged together, judging an original input of producing influence during the rollback process to each signal by employing the influence range technology, directing the generation process of the test vectors to generate two corresponding test vectors, determining the corresponding general folding set by the two test vectors, performing fault simulation by using each test vector of the general folding set, and checking all the faults which can be tested by the general folding set; next, generating complete general folding sets for the left faults by the method until all the faults can be completely detected; and finally obtaining a plurality of determined general folding sets. The method provided by the invention has the advantages that test data can be compressed according to a general folding principle, that is to say, the generated data is easier to compress.
Owner:ANQING NORMAL UNIV

Circuit and method for generating test vectors required by built-in self-test of integrated circuit

The invention relates to a circuit for generating test vectors required by built-in self-test of an integrated circuit. The circuit comprises an address counter, a sequence counter, a seed and multinomial coefficient storage unit, a sequence generator, a weight generating logical unit, 4-Line to 1-Line data selectors, an input register and scan chains, wherein the address counter is used for sending address data sequences; the sequence counter is used for sending data sequences; the seed and multinomial coefficient storage unit is connected with the address counter and used for sending output values of compressed vectors difficult and easy to test; the sequence generator is connected with the sequence counter and the seed and multinomial coefficient storage unit and used for outputting 2-bit data; the weight generating logical unit is used for outputting four-channel data values; the 4-Line to 1-Line data selectors are connected with the weight generating logical unit and the sequence generator and used for outputting one-channel data; the input register is connected with the 4-Line to 1-Line data selectors and used for registering data and loading updated data; the scan chains are connected with the input register and a tested circuit combinatorial logic unit and used for outputting the updated data. A tested circuit is connected with the scan chains and used for detecting faults of the tested circuit. The invention further provides a method for generating the test vectors required by built-in self-test of the integrated circuit.
Owner:INST OF AUTOMATION CHINESE ACAD OF SCI

Compression method for test data of irrational number storage test vector

ActiveCN104753541AReduce the number of codesReduce the number of test vectorsElectronic circuit testingCode conversionFault coverageCompression method
The invention discloses a compression method for test data of an irrational number storage test vector and relates to a fault coverage guided compression method for the test data of the irrational number storage test vector. The compression method comprises the following steps of firstly, generating a fault list according to a circuit structure of an integrated circuit to be tested; secondly, running an automatic test vector generation tool for faults to generate test vectors of corresponding faults; thirdly, counting the lengths of runs; fourthly, performing preliminary estimation on corresponding ranges of irrational numbers; fifthly, dichotomising the ranges of the irrational numbers, and successively approximating; sixthly, filling independent bits; seventhly, performing random test; eighthly, judging whether the fault list in the seventh step is empty or not, if the fault list is empty, turning to the ninth step, and otherwise, turning to the second step; ninthly, ending, and returning all records such as integers m and l corresponding to all the irrational numbers. According to the compression method disclosed by the invention, the coding of the irrational numbers and the generation of the automatic test vectors are combined, so that on one hand, coding numbers, corresponding to the test vectors, of easily-detected fault points are reduced, and on the other hand, the fault coverage is improved.
Owner:池州华宇电子科技股份有限公司

Dynamic memory testing system and dynamic memory testing method

The invention discloses a dynamic memory testing system and a dynamic memory testing method. The dynamic memory testing system comprises a test vector generation and update platform and a dynamic memory testing device, wherein the test vector generation and update platform is used for software simulation test by virtue of a dynamic memory simulation model, is used for grasping data in a test waveform to generate special test vectors according to current test, controlling the dynamic memory to be in a vector updating state, executing an operation of updating the vectors and updating the test vectors to the dynamic memory testing device; the dynamic memory testing device is used for storing the test vector used for current test and controlling the dynamic memory to execute the test flow. According to the system and the method disclosed by the invention, due to the test vector generation and update platform, various test vectors required by complete testing dynamic memory command combination can be generated, and are transmitted to the dynamic memory testing device on line to dynamically update the testing vectors so as to quickly and completely test the dynamic memory. The dynamic memory testing system and the dynamic memory testing method disclosed by the invention can be widely applied to the field of digital test.
Owner:SHENZHEN STATE MICROELECTRONICS CO LTD

Method for predicting voltage value of full-open defect of interconnecting wire of deep sub-micron integrated circuit

InactiveCN102708219APredict the voltage value of the fully open defect pointSpecial data processing applicationsCapacitanceCoupling
The invention discloses a method for predicting a voltage value of a full-open defect of an interconnecting wire of a deep sub-micron integrated circuit. By the method, the voltage at a full-open defect spot of an interconnecting wire can be accurately and efficiently determined in the designing stage of a chip. The method comprises the following steps of: establishing a first voltage prediction model, and establishing a second voltage prediction model based on the first voltage prediction model; extracting coupling capacitance values of peripheral signal wires of a metal wire which is suspected to have an open defect, and calculating a voltage logic by using the second voltage prediction model; and in the automatic test vector generating step of testability design, loading a test vector which is opposite to the calculated voltage logic, and finding the full-open defect on the metal wire if the situation that an open voltage logic is equal to the calculated value obtained by the second voltage prediction model is observed. The method has the advantages that two voltage models which are accurate and feasible in engineering are established, and a complete method for combining the two models is provided.
Owner:XI AN JIAOTONG UNIV
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