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77results about How to "Hinders provision" patented technology

Clamping apparatus with a clamping chuck and a work piece carrier releasably connectable thereto

The clamping apparatus comprises a clamping chuck and a work piece carrier releasably connected thereto. The clamping chuck is provided with a central opening for receiving a clamping pin attached to the work piece carrier. The central opening of the clamping chuck has a conical inserting portion, and the clamping pin has at least one surface portion corresponding in shape to the conical inserting portion, or several surface portions for aligning the clamping pin in X- and / or Y-direction. The clamping chuck comprises a clamping mechanism for clamping the clamping pin. The top of the clamping chuck is provided with at least one surface portion serving as a Z-stop member. The clamping pin is dimensioned such that, prior to activating the clamping mechanism, a gap exists between the flat bottom surface of the work piece carrier and the surface portion of the clamping chuck serving as a Z-direction stop member. The clamping pin and / or the region around the central opening of the clamping chuck is / are adapted to be elastically deformed upon activation of the clamping mechanism to further pull in the clamping pin into the central opening and simultaneously the work piece carrier towards the surface portion serving as a Z-direction stop member until the flat bottom surface of the work piece carrier rests on the surface portion of the clamping chuck serving as a Z-direction stop member.
Owner:EROWA

Clamping apparatus with a clamping chuck and a work piece carrier releasably connectable thereto

The clamping apparatus comprises a clamping chuck and a work piece carrier releasably connected thereto. The clamping chuck is provided with a central opening for receiving a clamping pin attached to the work piece carrier. The central opening of the clamping chuck has a conical inserting portion, and the clamping pin has at least one surface portion corresponding in shape to the conical inserting portion, or several surface portions for aligning the clamping pin in X- and/or Y-direction. The clamping chuck comprises a clamping mechanism for clamping the clamping pin. The top of the clamping chuck is provided with at least one surface portion serving as a Z-stop member. The clamping pin is dimensioned such that, prior to activating the clamping mechanism, a gap exists between the flat bottom surface of the work piece carrier and the surface portion of the clamping chuck serving as a Z-direction stop member. The clamping pin and/or the region around the central opening of the clamping chuck is/are adapted to be elastically deformed upon activation of the clamping mechanism to further pull in the clamping pin into the central opening and simultaneously the work piece carrier towards the surface portion serving as a Z-direction stop member until the flat bottom surface of the work piece carrier rests on the surface portion of the clamping chuck serving as a Z-direction stop member.
Owner:EROWA

Method for producing chip stacks and chip stacks formed by integrated devices

The method of the present invention relates to a method for producing a chip stack comprising the steps of manufacturing at least a first and a second integrated structure on a single substrate, an area of the first integrated structure and an area of the second integrated structure adjoining a respective first and second kerf area; providing a first redistribution layer on the first integrated structure on the substrate, said first redistribution layer at least partially extending beyond the area of the first integrated structure into the first kerf area, thereby forming a first integrated device area, wherein a first contact pad is arranged on the first redistribution layer in a first contacting area overlapping the first kerf area; providing a second redistribution layer on a second integrated structure on the substrate, including a second contact pad, thereby forming a second integrated device area; separating the first and second integrated device areas along a separation line defined by at least one of the boundaries of the first integrated device area and the second integrated device area, resulting in separated first and second integrated devices; and stacking the second integrated device on the first integrated device so that the first contacting pattern is uncovered by the second integrated device.
Owner:POLARIS INNOVATIONS LTD
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