The invention discloses a lead arc-forming method for manufacturing a salient point by utilizing laser. The method comprises the steps that step 1, a first welding point is formed in the central position point O of a chip welding pad (6); step 2, a chopper is vertically lifted to a point E, and a lead is released simultaneously; step 3, a point A is at least selected between the point O and the point E of the lead; laser energy is introduced to manufacture a local thermoplastic deformation point for the selected point to form a salient point; step 4, the distance, namely the absolute value of OF, between the point O and a point F is used as the minor axis of an ellipse, the major axis of the ellipse is 4000-8000 micrometer, the chopper moves to the point F from the point E along the elliptical orbit, under the combined action of heat and ultrasound applying on the chopper, a second welding point is formed in the midpoint position F of a frame welding pad (5), and a required large-span low-arc lead is formed. With the implementation of the lead arc-forming method, the movement trail of the chopper is greatly simplified, and the large-span low-arc lead is formed.