The invention relates to a
semiconductor cleaning device, the cleaning device is used for removing impurities on the surface of a
wafer, the cleaning device comprises a cleaning mechanism, the cleaning mechanism comprises a material seat, a flow guide seat, a drainage piece and a cleaning
assembly, the material seat is controlled to rotate, the material seat comprises a placing plane used for placing the
wafer, and the flow guide seat is controlled to rotate. According to the
semiconductor cleaning device, the technical means that the material seat and the flow guide seat are coaxially arranged and the
radius of the edge contour of the flow guide surface is smaller than the
radius of the
wafer is adopted, so that cleaning liquid is effectively prevented from entering a gap between the wafer and the flow guide seat, the flow path of the cleaning liquid is accurately controlled, and meanwhile, the service life of the cleaning liquid is prolonged. Through the first annular groove and the second annular groove which are arranged in a concentric structure,
inert gas and pure water are sprayed on the back side of the wafer, so that double blocking is formed on the back side of the wafer, the problem of cleaning liquid residue caused by uneven flow velocity or
sputtering is effectively solved, and the effect of preventing the cleaning liquid from permeating into the gap is achieved.