39results about How to "Enhance adhesion" patented technology

The present invention relates generally to photovoltaic devices. The present invention relates more particularly to photovoltaic roofing products in which a photovoltaic element is joined to a roofing substrate. In one embodiment, the present invention provides a photovoltaic roofing element comprising: an encapsulated photovoltaic element having a top surface and a bottom surface, a top layer material at its top surface and a bottom layer material at its bottom surface; a roofing substrate having a top surface; and a tie layer system disposed between the encapsulated photovoltaic element and the roofing substrate and joining the bottom surface of the encapsulated photovoltaic element to the top surface of the roofing substrate.

A medical device having a lubricious coating on at least a section of the medical device, and a method of coating a medical device, the lubricious coating being a network of a hydrophilic compound cross-linked to itself and interlocked with a network of a cross-linked polymerized multifunctional monomer or polymer. The coating can include one or more agents which provide enhanced adhesion of the coating on the device, or which provide faster hydration of the coating and/or improved lubricity. Additionally, the lubricious coating can be provided with one or more therapeutic or diagnostic agents, and in one embodiment the agent elutes relatively quickly in a concentrated release from the lubricious coating upon hydration of the coating.

An image receiving element is a composite of two or more extruded layers on a support including, in order, an extruded compliant layer, an extruded antistatic tie layer, and an image receiving layer that may also be extruded. The extruded compliant layer is non-voided and comprises from about 10 to about 40 weight % of at least one elastomeric polymer. This image receiving element can be disposed on a support to form a thermal dye transfer receiver element, an electrophotographic image receiver element, or a thermal wax receiver element. Two or more extruded layers can be co-extruded.

Chromate-free treatments and compositions, for applying a conversion or passivation coating to zinc coated metal surfaces. The compositions comprise a polyamidoamine/epihalohydrin polymer or cationic polyamine/epihalohydrin polymer component, fluoacid, H₃PO₄, and a film forming polymer latex component. The requisite metal surfaces are contacted by the compositions and dried. Rinsing is optional.

The present invention relates to an insulating wire and, more particularly, to an insulating wire having partial discharge resistance that exhibits excellent partial discharge resistance and high partial discharge inception voltage and also excellences in the adhesion between the conductor and the insulation layer and the flexibility of the insulation layer, which insulating wire can be prepared by a simple process at a low production cost.

A steam turbine rotor wheel includes a plurality of blades secured about a circumferential periphery of the wheel, each blade comprising a shank portion and an airfoil portion, the airfoil portion having at least one pocket filled with a filler material, wherein at least one edge of the pocket adjacent a leading edge of the blade is formed with an undercut.

A composite extrusion for an automotive seal strip is formed of an extruded body, and a veneer extruded onto the body. The extruded body is composed of ethylene-propylene diene rubber compound. The veneer is composed of a polymer blend that includes the reaction product of an acrylate polymer and a glycidyl acrylate polymer. The reaction of the acrylate polymer and the glycidyl acrylate polymer improves adhesion and also provides a barrier to inhibit migration of vulcanizing agents from the ethylene-propylene diene rubber body into the veneer that would otherwise cause discoloration during use.

A packaged semiconductor device (100) comprising a leadframe having a pad (101) with an assembled semiconductor chip (110), a plurality of straps (102) connecting the pad to side edges of the device package, leads (103), and a package (150) of plastic compound adhering to the leadframe; at least one surface (102a) of the straps covered with a layer (120) of a compound both non-adhesive to polymeric compounds and hydrophobic; the compound (220) selected from a group including fluorinated thiol compounds, fluorinated amine compounds, fluorinated aminesilanes, organosilanes, and their derivatives; or the compound (330) selected from a group including open-pore microcellular metal foams and polymer foams. Further, the package may include an array of holes through the plastic compound, extending from the package surface to the strap surface.

Disclosed is a method for producing carbon fibers which exhibit excellent adhesion to a matrix resin and have excellent processability. Specifically disclosed is a method for producing a sizing agent-coated carbon fibers, wherein at least one kind of sizing agent that is selected from the group consisting of sizing agents (a), (b) and (c) described below is used for coating, in each of said sizing agents a bi- or higher functional epoxy compound (A1) and/or an epoxy compound (A2) being used as a component (A), and said epoxy compound (A2) having a mono- or higher functional epoxy group and at least one functional group that is selected from among a hydroxyl group, an amide group, an imide group, a urethane group, a urea group, a sulfonyl group and a sulfo group. The method for producing a sizing agent-coated carbon fibers is characterized in that the sizing agent is applied to carbon fibers and the resulting is subjected to a heat treatment within the temperature range of 160-260° C. for 30-600 seconds. (a) A sizing agent which is obtained by blending at least 0.1-25 parts by mass of a tertiary amine compound and/or tertiary amine salt (B1) having a molecular weight of 100 g/mol or more per 100 parts by mass of the component (A), said tertiary amine compound and/or tertiary amine salt (B1) being used as a component (B). (b) A sizing agent which is obtained by blending at least 0.1-25 parts by mass of a quaternary ammonium salt (B2) having a cationic moiety represented by general formula (I) or (II) per 100 parts by mass of the component (A), said quaternary ammonium salt (B2) being used as a component (B). (In the formulae, R₁-R₅ each represents a hydrocarbon group having 1-22 carbon atoms, a group that contains a hydrocarbon having 1-22 carbon atoms and an ether structure, a group that contains a hydrocarbon having 1-22 carbon atoms and an ester structure, or a group that contains a hydrocarbon having 1-22 carbon atoms and a hydroxyl group; and R₆ and R₇ each represents a hydrogen atom, a hydrocarbon group having 1-8 carbon atoms, a group that contains a hydrocarbon having 1-8 carbon atoms and an ether structure, or a group that contains a hydrocarbon having 1-8 carbon atoms and an ester structure.) (c) A sizing agent which is obtained by blending at least 0.1-25 parts by mass of a quaternary phosphonium salt and/or phosphine compound (B3) per 100 parts by mass of the component (A), said quaternary phosphonium salt and/or phosphine compound (B3) being used as a component (B).

A transparent barrier sheet comprising on one side of a substrate sheet at least one transparent inorganic layer and at least one transparent organic layer, wherein an outermost layer of the inorganic layer and the organic layer exhibits a surface roughness Ra of not more than 5 nm and the transparent inorganic layer exhibits a thickness of 20 nm to 500 nm, and the transparent barrier sheet meeting the requirement:

0.5≦d2/d1≦10

wherein d1 is a thickness of the inorganic layer and d2 is a thickness of the organic layer.

A counter tapered thermoplastic elastomer composition comprising: (a) a counter tapered diblock A-[A/B] copolymer with a peak molecular weight from 20,000 to 250,000, which includes a monovinyl aromatic homopolymer block A with a peak molecular weight of at least 8,000 and a counter tapered copolymer block [A/B] with a vinyl content of at least 15 weight percent based on the amount of conjugated diene units in the diblock copolymer; and (b) a block copolymer selected from the group consisting of linear triblock copolymers having a peak molecular weight that is at least about 1.5 times the peak molecular weight of the counter tapered diblock A-[A/B] copolymer described In (a), multiarm coupled block copolymers having a peak molecular weight that is at least about 2.5 times the peak molecular weight of the counter tapered diblock A-[A/B] copolymer described in (a), and mixtures thereof; and (c) wherein the ratio of (a) to (b) in the counter tapered thermoplastic elastomer composition is from about 1:5 to about 5:1. The counter tapered thermoplastic elastomer compositions provide in the applications: i) easy processing such as short dispersion time, low mixing temperature, low viscosity, excellent storage stability; and ii) better reinforcement such as high elastic response, wide range of performance grade, high adherence, higher filler loading capacity, and better compromise between high and low temperature properties; which make them suitable for a broad range of applications such as road paving, roofing, shingles, waterproofing membranes, adhesive tapes and labels, contact and sprayable adhesives, and sealants.

A display device includes a display panel, a cover, a bonding member, a guide mold and at least one fastening member. The cover is above the display panel. The bonding member is on a surface of the cover and includes a plurality of non-recessed portions and a plurality of recessed portions between the plurality of non-recessed portions. The guide mold accommodates a light source below the display panel and includes a plurality of protruding portions protruding from a side surface thereof, each of the plurality of protruding portions respectively corresponding to each of the plurality of non-recessed portions. The at least one fastening member penetrates a corresponding one of the plurality of protruding portions of the guide mold to be fastened to a corresponding one of the plurality of recessed portions.

Provided are energy curable inks and coatings that have improved adhesion on flexible substrates, such as non-chemical coated flexible films at fast speed. Also provided are raw material screening methods for quantifying acrylate group concentration, which is used to adjust the ink or coating formula to improve the cure at the surface and bottom and to improve tape adhesion and MEK resistance of energy cured inks and coatings.

A rubber-reinforcing cord (12) as a rubber-reinforcing member of the present invention is a rubber-reinforcing member for reinforcing a rubber product (such as a toothed belt (1)). The rubber-reinforcing cord (12) includes a reinforcing fiber or a reinforcing fiber sheet, and a first coating film provided on a surface of the reinforcing fiber or a surface of the reinforcing fiber sheet. The first coating film is formed by applying a first treatment agent containing polyvinyl alcohol and a crosslinking agent to the reinforcing fiber or the reinforcing fiber sheet and drying the first treatment agent. In the reinforcing member of the present invention, a second coating film as a primary coating film may be provided on the surface of the reinforcing fiber or the surface of the reinforcing fiber sheet. The second coating film can be produced using a second treatment agent containing a rubber latex, for example.

A chip packaging structure and packaging method. The packaging structure comprises: a semiconductor substrate; a metal pad provided inside the semiconductor substrate; an insulating layer provided on the semiconductor substrate, the insulating layer having an opening for exposing the metal pad; a sub-ball metal electrode provided on the metal pad; a solder ball provided on the surface of the sub-ball metal electrode, the solder ball having a first apron structure and the first apron structure covering partial metal pad on the periphery of the bottom of the under-ball metal electrode. The chip packaging structure of the present invention enhances the adhesion between the solder ball and the metal pad, and improves the reliability in chip packaging.

A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a solder mask on the oxide layer; forming a composite layer on the first set of conductors; and forming a solder layer on at least a portion of the third set of conductors.

A compound represented by formula (I):a compound represented by (II):or a mixture of at least one compound represented by formula (I) with at least one compound represented by formula (II), wherein M is hydrogen, an alkali atom or an ammonium group; R<1 >is hydrogen, a -(CH2)mSO3M group or aR<2 >is an alkyl-, alkenyl- or alkynyl- group having 6 to 25 carbon atoms; and m is an integer between 1 and 5; the use of at least one compound represented by the above-mentioned formula (I), at least one compound represented by the above-mentioned formula (II) or a mixture of at least one compound represented by the above-mentioned formula (I) and at least one compound represented by the above-mentioned formula (II) as a surfactant; and a photographic material comprising a support and a layer containing photosensitive silver halide, characterized in that the photographic material contains at least one compound represented by the above-mentioned formula (I), at least one compound represented by the above-mentioned formula (II) or a mixture of at least one compound represented by the above-mentioned formula (I) and at least one compound represented by the above-mentioned formula (II).

The invention relates a mixture of a urethane-aldehyde resin UA prepared by condensation of an aldehyde A1 and an alkyl urethane U, and of a novolak PA, to a process for the preparation of the said mixture, and a method of use thereof as adhesion promoter in rubber goods.

It describes an ear tag for livestock including: a plastic substrate including means to apply the ear tag to an ear of an animal; an UHF inlay coupled to a flexible flat portion of the plastic substrate, the UHF inlay including a substrate, an antenna on the substrate and a microchip connected to the antenna. The ear tag includes a plastic film; a predetermined portion of the plastic film is laminated on the plastic substrate and forms a closed pocket; the UHF inlay is enclosed in the pocket and is at least in part movable independently from the plastic substrate and the plastic film in the pocket.

The present invention provides a method for manufacturing a graphene composite film including preparing a zeolite suspension and a graphene oxide suspension containing graphene oxide, reducing the graphene oxide suspension until the graphene oxide is partially reduced to form partially-reduced graphene oxide, followed by adding the zeolite suspension and a surfactant into the partially-reduced graphene oxide suspension to form a composite solution, further reducing the composite solution until the partially-reduced graphene oxide is completely reduced to form graphene, and forming the composite solution into the graphene composite film on a substrate via plasma-enhanced atomizing deposition.

This invention relates to a surface modified silica by an alkyl sulfonated tetrazole compound, a preparation method thereof, and a resin composition containing the same. The silica according to this invention can exhibit superior adhesion to a metal.

Implantable medical devices with elastomeric copolymer coatings are disclosed.

A conductor includes: a transparent conductive film which is formed on a transparent substrate and includes a silver nanowire; and a metal film of which at least a portion is formed to overlap the transparent conductive film, in which a portion in which the transparent conductive film and the metal film overlap each other includes a buffer film which has adhesion to each of the transparent conductive film and the metal film and does not impede conduction between the transparent conductive film and the metal film. Preferably, the buffer film is, for example, an ITO film, and at this time, an upper surface of the transparent conductive film is a reverse-sputtered surface.

A composite material for an electric/electronic part, having a metal base, a resin film on at least a part of the metal base, and a layer of Sn or a Sn alloy on at least a part of the metal base at a site where the resin film is not provided, the layer of Sn or a Sn alloy including a solidified structure, and the resin film having a residual solvent quantity adjusted to 5% to 25% by mass.

A label 1 includes a first colored layer 10, a second colored layer 20 having a different color from the first colored layer 10, and an indicating layer 30 having a different color from the first colored layer 10 and the second colored layer 20. The indicating layer 30 is fitted into the first colored layer 10 so as to have an exposed surface on one surface of the first colored layer 10. The second colored layer 20 is laminated on the other surface F2 of the first colored layer 10. The curing shrinkage ratio of the first colored layer 10 is larger than that of the indicating layer 30.

A radiological image detection apparatus includes: a phosphor which contains a fluorescent material emitting fluorescence when exposed to radiation; and a sensor panel which detects the fluorescence; in which the sensor panel has a substrate and a group of photoelectric conversion elements provided on one side of the substrate; the phosphor adheres closely to an opposite surface of the substrate to the side where the group of photoelectric conversion elements are provided; and an irregular structure is formed in the surface of the substrate to which the phosphor adheres closely.

An electric conductivity-based biosensor electrochemically detects the concentration of tested objects via measuring impedance or capacitance variation of the tested objects. The biosensor comprises a substrate, two electric-conduction electrodes arranged on the substrate, an antibody adhesion layer arranged on a region of the substrate and a plurality of antibodies arranged on the antibody adhesion layer. The antibody adhesion layer is between the two electric-conduction electrodes. The antibodies are connected with a plurality of tested objects. The tested objects connected with the antibodies form an electric-conduction group contacting the two electric-conduction electrodes. The concentration of the tested objects can be provided via measuring impedance or capacitance between the two electric-conduction electrodes.

Disclosed herein a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer disposed between the lower electrode layer and the upper electrode layer. The lower electrode layer includes a first metal layer positioned on a side facing the dielectric layer and a second metal layer positioned on a side facing away from the dielectric layer. The first metal layer has a first surface positioned on a side facing the second metal layer and a second surface positioned on a side facing the dielectric layer. The first surface has a surface roughness higher than that of the second surface. The second metal layer reflects a surface property of the first surface.

Disclosed herein is a thin film capacitor that includes a capacitive insulating film having first and second through holes, a first metal film provided on one surface of the capacitive insulating film, and a second metal film provided on the other surface of the capacitive insulating film. The first and second metal films are made of different metal materials from each other. The first metal film is divided into a first area positioned outside the first space and a second area positioned inside the first space. The second metal film is divided into a third area positioned outside the second space and a fourth area positioned inside the second space. The third area is connected to the second area through the first through hole. The fourth area is connected to the first area through the second through hole.

The present invention relates to a method for preparing an antimicrobial peptide with enhanced adhesion, and an antimicrobial coating method of the antimicrobial peptide with enhanced adhesion. The antimicrobial coating method of the present invention can be widely used as a method for adding an antimicrobial property to medical products and industrial products, because the method is capable of coating the antimicrobial peptide with enhanced adhesion, which has no cytotoxicity and possesses an excellent antimicrobial activity, on various surfaces with optimal efficiency.