The invention provides a method for interplanting high-quality and high-yield corn with soybean. The method comprises the steps of seed selection, seed treatment, soil preparation, sowing, soil covering, film mulching, fertilization, growth period management and harvesting. Two rows of corn and four rows of soybean are planted, the corn and the soybean are matched in height, no chemical or pesticide is applied in the whole planting process, and only a foliar fertilizer is sprayed. During seed treatment, the seeds are soaked with the same foliar fertilizer, the vigor of the seeds is increased from the beginning, and the germination rate is improved. After seedling emergence, root systems are developed, leaves are fat, stems are thick, leaves are dark green, the growth vigor is vigorous in the seedling stage, and sufficient water and fertilizer energy supply is ensured by powerful root system plants. While plants are sufficiently supplied to grow quickly, the bidirectional stress resistance of plant diseases, insects, drought, waterlogging, low temperature, high temperature, even saline-alkali soil and the like is remarkably enhanced, high yield and high quality are achieved withoutchemical fertilizers and pesticides, the yield per mu of corn is 1400 kg or above, the hundred-grain weight of the corn is 42-52 g, and the yield per mu of the soybean is 400 kg or above.