The invention provides a planting method for Salvia miltiorrhiza. The planting method comprises the following steps: construction of high ridges: deep-ploughing a target land, carrying out leveling, crushing and harrowing, constructing high ridges, and leveling the surfaces of the ridges; digging of sowing ponds on the surfaces of the ridges: starting from one end of the surface of each ridge, digging ponds at the positions of 15 cm away from two sides of each ridge, and allowing three ponds to form a group, wherein the ponds are closely adjacent, and a distance of two groups of ponds is 25 cm; application of a manure fertilizer and a pesticide: applying a fine manure fertilizer and the pesticide into the ponds, covering the surface of each ridge with a black film, and manually carrying out holing, wherein holes are in one-to-one correspondence to the ponds; sowing: irrigating water into the ponds, and after soil is fully moisturized, carrying out sowing; management in a seedling period: continuously spraying water every other day for 4 to 5 times in a rainless season; drawing-out of seedlings and sealing with soil: when a Salvia miltiorrhiza seedling grows to 10 cm high, drawing all overground stems and leaves of the Salvia miltiorrhiza seedling out from holes of the film, and compacting and sealing the basal part of the Salvia miltiorrhiza seedling with a small amount of soil; and subsequent management: regularly carrying out watering for 2 to 3 times in drought weather in an early stage, carrying out topdressing in May to August, and respectively removing flower buds once in June and August.