The invention relates to a device for preparing a high-quality high-depth-
diameter-ratio micro hole by using a light
ray obtained through
femtosecond laser time domain / space shaping, and belongs to the field of transparent material micro-
machining. According to the technical scheme,
pulse time domain shaping equipment is used for generating a
femtosecond laser pulse sequence; the position of a to-be-machined sample is adjusted to enable the light rays to generate
micro holes with the maximum depths in the sample; the
neutron pulse time delay of the
pulse sequence is optimized so as to improvethe micro hole quality; a half-wave plate and a polarizing plate are combined for use to adjust the energy of lasers focused by two lenses correspondingly so as to enable the diameters of the
micro holes formed by the lasers after being focused by the two lenses in the to-be-machined sample to be equal; the two focusing lenses are adjusted to enable the two independent light rays to be collinear in space and to be overlapped in an end-to-end mode to form an extended uniform light
ray; and the position of the sample is moved to enable the light
ray which is overlapped in the end-to-end mode togenerate a micro hole with the
maximum depth-
diameter ratio on the sample. According to the device, the quality and the depth-
diameter ratio of the machined micro hole can be remarkably improved, themicro hole diameter adjusting range is wide, the
machining environment is free of special requirements, the
machining efficiency is high, and the machining cost is low.