The invention relates to the technical field of
semiconductor packaging equipment, and discloses a four-vibration-disc and four-funnel stock bin feeding die bonder which comprises a
machine body and four vibration discs, four XY-axis manual moving tables are arranged on the table top of the
machine body, a bearing table is fixedly connected to a moving plate of each XY-axis manual moving table, and a feeding mechanism is arranged on the bearing table. The four vibration discs are installed at the tops of the four bearing tables respectively, every two adjacent vibration discs are in
axial symmetry, feeding rails are arranged at the tops of the bearing tables, and the feeding ends of the feeding rails are connected with the discharging ends of the vibration discs; the top of the bearing table is provided with a detection
assembly and a material supplementing
assembly. According to the invention, parallel feeding of four vibration discs is combined with
visual screening, the production efficiency and productivity are improved, the design of bulk material direct connection
die bonding is adopted, the technological process is simplified, the cost is reduced, the vibration discs are rapidly replaced, the universality of equipment is enhanced, a front-back bidirectional plate
feeding mode is adopted, and the flexibility of
production line layout and the comprehensive
utilization rate of the equipment are improved.