The invention discloses packaging equipment for a thick-film
chip resistor. The packaging equipment comprises a vibrating disc, a
resistor track, a carrier tape track, a packaging mechanism, a thin film conveying
assembly and a
manipulator, the vibrating disk is connected with a resistance track, the resistance track is parallel to the carrier tape track, and the packaging mechanism is installed on the carrier tape track; the thin film conveying
assembly conveys a strip-shaped thin film to move forwards, and the strip-shaped thin film is parallel to the carrier tape track; the mechanical arm comprises a basic platform, a moving platform, a first air cylinder, a
resistor grabbing
assembly and a film grabbing assembly. The moving platform and the first air cylinder are both installed on thebasic platform, the first air cylinder drives the moving platform to horizontally move, and the moving direction of the moving platform is perpendicular to the carrier tape track. According to the packaging equipment for the thick-film
chip resistors, the thin-film grabbing assembly is linked with the resistor grabbing assembly, the thin-film grabbing assembly can insert one thin-film piece between the two
chip resistors in time, the two chip resistors in the same hole are separated by the thin-film piece, and mutual friction between the two chip resistors is avoided.