30results about How to "Constant impedance" patented technology

Lightweight, low cost, high density electrical connectors are disclosed that provide impedance controlled, high-speed, low interference communications, even in the absence of shields between the contacts, and that provide for a variety of other benefits not found in prior art connectors, such as low insertion loss. Signal contacts and ground contacts within the connectors can be scaled and positioned relative to one another such that a differential signal in a first differential signal pair produces a high field in the gap between the contacts that form the signal pair and a low field near an adjacent signal pair. Consequently, cross talk between adjacent signal contacts can be limited to acceptable levels for the particular application. In such connectors, the level of cross talk between adjacent signal contacts can be limited to the point that the need for (and cost of) shields between adjacent contacts is unnecessary, even in high speed, high signal integrity applications.

A high-density orthogonal connector is disclosed and may include electrical contacts that are configured to receive contacts from an orthogonal header connector while minimizing signal skew and signal reflection. The electrical contacts in the connector may define contact pairs (e.g., differential signal pairs). Each contact pair may include a lead portion and a mating interface that extends from the lead portion. The lead portions of the contact pair may define a first plane. One contact of the contact pair defines a first mating interface defining a second plane and the other contact in the contact pair defines a second mating interface defining a third plane. The second plane and the third plane may be both substantially parallel to and offset from the first plane in opposite directions. The contact pair may be configured such that the overall length of each contact within the pair may be substantially the same.

A high-density orthogonal connector is disclosed and may include electrical contacts that are configured to receive contacts from an orthogonal header connector while minimizing signal skew and signal reflection. The electrical contacts in the connector may define contact pairs (e.g., differential signal pairs). Each contact pair may include a lead portion and a mating interface that extends from the lead portion. The lead portions of the contact pair may define a first plane. One contact of the contact pair defines a first mating interface defining a second plane and the other contact in the contact pair defines a second mating interface defining a third plane. The second plane and the third plane may be both substantially parallel to and offset from the first plane in opposite directions. The contact pair may be configured such that the overall length of each contact within the pair may be substantially the same.

A connector system includes first and second mateable connectors (12, 14) with coaxial contacts, wherein the first connector has movable center and outer contacts (20, 22) that are each biased forward by a separate spring (24, 26) to engage stationary contact pads (34, 36) of the mating second connector. A stationary tubular insulator (100) surrounds much of the movable center contact, and a stationary sheet metal shield (102) lies around the tubular insulator and within the outer contact. The front end of the movable outer contact forms an internal flange (80) with a hole (84) that allows the front end of the movable center contact to pass through. The shield front-end has an internal flange (112) that lies between the front end of the tubular insulator and the movable outer contact internal flange, to maintain a constant impedance through out the first connector.

A mezzanine style electrical connector is disclosed. The connector includes first and second arrays of electrical contacts extending through a connector housing. Each contact array may include single ended signal conductors or differential signal pairs or a combination of both. The contact arrays are disposed adjacent to one another such that cross-talk between adjacent signal contacts is limited, even in the absence of any electrical shielding or ground contacts between the contact arrays.

An electrical connector system is disclosed and may include a header connector and a receptacle connector. The contacts in the header connector may be edge-coupled to limit the level of cross-talk between adjacent signal contacts. For example, a differential signal in a first signal pair may produce a high-field in the gap between the contacts that form the signal pair, and a low-field near a second, adjacent signal pair. The contacts in the receptacle connector may be broadside-coupled and configured to receive the contacts from the header connector while minimizing signal skew. For example, the overall length of the contacts within a differential signal pair may be the same. The contacts in the connector system may include differential signal pairs, single-ended contacts, and / or ground contacts. The connector system may be devoid of any electrical shielding between the signal contacts.

A connector or first plug is provided for receiving a mating plug or second plug, forming a constant impedance connection. The center conductor of the first plug is supported for enhanced structural integrity with a cap attached over a portion of the center conductor that extends beyond the outer conductor portion of the same plug. The constant impedance connection consists of the two plugs partially or fully engaged. The mating plug has an outer conductor that projects beyond the inner conductor, and is made to receive the connector or first plug portions. Once engaged, the connector and mating plug have mating dimensions that satisfy an impedance equality expression for a relationship between the inner conductor cap's outer diameter, the outer conductor's inner diameter, and the dielectric constant.

A jacketed light emitting diode assembly is provided, which includes a light emitting diode including a set of positive and negative contacts, and a lens body containing a semiconductor chip and end portions of the contacts. An electrical wire set of first and second electrical wires are connected to the positive contact and the negative contact, respectively. A light transmissive cover receives the lens body, and has an opening through which at least one of the contact set and the electrical wire set passes. An integrally molded plastic jacket at the opening of the light transmissive cover provides a seal at the opening against moisture and airborne contaminants. A waterproof light string including one or more of the jacketed light emitting diode assemblies is also provided, as are related methods.

In an I / O circuit unit located in the periphery of a semiconductor chip, a plurality of ESD protection transistors are provided in each I / O cell. An electrode pad cell has a two-layer structure including a lower electrode pad and an upper electrode pad. The electrode pad cell is arranged so as to be present over a connection line of ESD protection transistors of an associated I / O cell. With part of the first pad portion of an adjacent electrode pad located in an end portion of the second pad portion of the electrode pad, the second pad portion can not extend further onward but the third pad portion having a smaller width than that of the second pad portion is arranged onward. Thus, destruction of the ESD protection transistors is not caused, so that an internal circuit is protected from an electrostatic discharge which comes into electrode pads.

An outdoor satellite receiving unit (ODU) receives several independent satellite signals, selects two signals with a switch matrix, downconverts the two signals to a bandstacked signal with a high and a low band signal, and outputs the bandstacked signal on the same cable to receiver units. Several satellite signals can be selected in groups of two or more and output to independent receiver units. Signal selecting is performed at the received radio frequency (RF) and bandstacking is performed with a single downconversion step to an intermediate frequency (IF). Channel stacking on the same cable of more than two channels from several satellites can be achieved by using frequency agile downconverters and bandpass filters prior to combining at the IF output. A slow transitioning switch minimizes signal disturbances when switching and maintains input impedance at a constant value.

A multipolar outlet for a conductor connector system. The outlet includes a housing divided into at least two chambers, each chamber including two contacts accessible from a first end of the chamber. The outlet further includes a separator for separating conductor wires and for holding the wires in place in the separator, the separator being arranged to form an end piece for the chambers at a second end, opposite to the first end, wherein the contacts are arranged to be electrically connected to the wires when the separator is in place in the housing.

A non-contact power transmission device equipped with a ground-side device and a vehicle-side device. The ground-side device has a primary-side coil to which alternating-current power is input. The vehicle-side device includes a secondary-side coil, a battery, a secondary-side matching device, and a charging device. The secondary-side coil receives alternating-current power from the primary-side coil in a non-contact manner. The secondary-side matching device is provided between the secondary-side coil and the battery, and has a predetermined fixed inductance and fixed capacitance. The charging device has a switching element that performs a switching operation with a prescribed cycle. The charging device adjusts the duty ratio of the switching operation in accordance with the impedance of a load.

A switching combiner unit (SCU) may combine coherent RF or microwave outputs from multiple power amplifier units (PAUs). Each SCU may be able to be switched between an on-line mode (on-line PAU), during which the PAU amplifies a coherent instance of the same RF or microwave input signal and delivers that amplified input signal to an output, and a standby or off-line mode (standby / off-line PAU), during which the PAU does not amplify an instance of the same RF or microwave input signal or deliver an amplified input signal to the output. The SCU may include an input port that connects to each of the PAU outputs; a control signal input that receives one or more control signals that indicate whether each PAU is in the on-line or standby / off-line mode; signal combining circuitry that coherently sums the outputs from all of the on-line PAUs, while simultaneously isolating the standby / off-line PAUs from the output of the SCU and the outputs of the on-line PAUs; and an SCU output port that delivers the coherently summed outputs from all of the on-line PAUs.

A high power RF or microwave amplifier may amplify an RF or microwave input signal. The high power RF or microwave amplifier may include an input signal divider (DIV) that has an input port that receives the RF or microwave input signal and that divides this input signal into multiple sub-input signals; multiple power amplifier units (PAUs), each having an input port that receives an RF or microwave signal, an output port that delivers an amplified version of the received RF or microwave signal, and an interface port; an interface control unit (ICU) that communicates with each PAU through its interface port; and an output signal switching combiner unit (SCU) that coherently sums the outputs of the on-line PAUs and delivers this to an output port. The ICU may set one or more of the PAUs to amplify one of the multiple sub-input signals (hereinafter referred to as on-line PAU in on-line mode); monitor each on-line PAU to verify that it is operating within one or more pre-determined PAU specifications; and upon detecting that one of the on-line PAUs is no longer operating within the one or more pre-determined PAU specifications (malfunctioning PAU), set the malfunctioning PAU not to amplify one of the multiple sub-input signals and not to be available to be switched to the on-line mode by the ICU (hereinafter referred to as off-line PAU in off-line mode).

An impedance controller includes a current mirror section to generate an impedance current. At least one detector includes a transistor array and an impedance corresponding to the impedance current, the at least one detector operating responsive to a code generator. And an at least one code generator generates a first code to adjust a gate voltage of the transistor array by comparing an output of the at least one detector to a reference voltage and generates a second code to adjust a size of the transistor array by comparing the output from the at least one detector to the reference voltage.

A compensated driver for maintaining constant impedance during data transfer from an integrated circuit comprises an output portion having an output device to transfer data from the integrated circuit and a mimic circuit portion having a sample output device scaled to a fraction of the output device adapted to accept a reference current and generate a sample voltage. A mimic circuit portion has a sample output device scaled to a fraction of the output device adapted to accept a reference current and generate a sample voltage. A differential amplifier portion is adapted to generate a control voltage in response to a reference voltage and the sample voltage A predrive portion applies either a ground or the predetermined control voltage from the differential amplifier portion to the output stage portion in response to an input, the control voltage regulating the output device in the output stage portion to achieve a more constant impedance

In an optical curable resin (OCR) composite for laminating optical substrates and a method of using the OCR composite to laminating two optical substrates, the OCR composite is formed by projecting an ultraviolet light to cure a liquid adhesive containing a plurality of bead-shaped elastic particles, and the method includes the steps of coating the liquid adhesive onto a first optical substrate, stacking the first optical substrate to a second optical substrate, such that each particle is separated between the first and second optical substrates, and projecting the ultraviolet light onto the first and second optical substrate again to cure the liquid adhesive, so that the particles are separated to form a gap with equal heights between the first and second optical substrates to enhance the lamination efficiency and quality of the optical substrates.

A self-similar log-periodic antenna is described comprising a plurality of substantially triangular conductive elements, 4, symmetrically disposed in either planar or curved configurations about a central conductive boom to form an antenna arm. Two or more antenna arms are assembled into an antenna by symmetrically locating such antenna arms substantially in the shape of a pyramid (for planar arms) or in a conical shape (for curved arms). Some embodiments include a conductive fin, 5, to reduce cross-polarization coupling between antenna arms. Some embodiments include a grounded conductive shield on the interior of the antenna providing electromagnetic shielding for the interior region of the antenna while preserving the self-similar geometry of the antenna and shield combination.

An output driver is provided that adapts an output impedance of the output driver to the voltage level of a power supply, thereby providing a constant output impedance over a range of different operating voltages. The output driver includes a plurality of individual driver circuits, each one of the plurality of individual driver circuits configured to provide a plurality of predetermined output impedances in response to a plurality of power supply voltage level inputs and a decoder. The decoder of the output driver is configured for receiving a digital codeword representative of a voltage level of a power supply coupled to the output driver and for decoding the digital codeword to activate one or more of the individual driver circuits to provide a constant output impedance from the output driver in response to the voltage level of the power supply coupled to the output driver, wherein the constant output impedance is a combination of the predetermined output impedances of the activated individual driver circuits.

The invention discloses a broadband dual-frequency fusion antenna based on a reflection surface and communication equipment. The broadband dual-frequency fusion antenna comprises a reflection plate, a low-frequency antenna radiation unit, a metasurface structure and a high-frequency antenna radiation unit, wherein the high-frequency antenna radiation unit is arranged above the reflection plate, the low-frequency antenna radiation unit is arranged above the high-frequency antenna radiation unit, and the metasurface structure is located above the high-frequency antenna radiation unit. The broadband dual-frequency fusion antenna is novel in structure, high in isolation degree and stable in directional diagram.

A head suspension for a disk drive has a load beam. The load beam consists of a rigid part and a resilient part that are independent of each other. The head suspension is capable of suppressing impedance variations in a flexure and avoiding air disturbance. The head suspension has a plate attached to a carriage, the load beam having the rigid part and the resilient part, and the flexure attached to the load beam and extended toward the plate. The resilient part of the load beam is made of a resilient material that is independent of the rigid part. A first side of the resilient material is laid on an end of the rigid part and joined thereto. A second side of the resilient material is joined to the plate. The first side of the resilient material is provided with a cut to partly expose the end of the rigid part. The flexure is extended through the cut toward the plate.

An object of the present invention is to provide a novel structure of supporting a vibrator having a terminal for electrical connection so that the vibrator can be miniaturized, and the driving impedance can be made constant in a wide temperature range to reduce the temperature drift. The structure has a substrate and bonding wires 45, 46 supported on the surface of the substrate and to be connected with the vibrator. The vibrator is supported with the bonding wire so that the vibrator is not directly contacted with the substrate. The bonding wire is electrically connected with the terminal. The resonance frequency “fr” of the supporting structure, the driving frequency “fd” for the vibrator and the detuning “Δf” satisfy the following formula1.1·Δf≦fr≦0.9·fd.

An integrated resistor-capacitor (RC) structure (400) is disclosed. The integrated RC structure includes a vertical capacitor (302,402,306) and a resistive element (308,310) disposed above the capacitor. The integrated RC structure uses a low ohmic substrate (302) to ensure a good ground return path for the capacitor. Further, a resistivity of the substrate is configured such that a top plate (306) of the capacitor provides a reference ground above a predefined frequency. The impedance of the resistive element (308,310) is matched, relative to the reference ground, to a predetermined resistance. As such, the resistance of the resistive element (308,310) can be controlled to provide an impedance controlled RC structure over a range of operating frequencies.

There is described a rectifier circuit for providing and limiting a supply voltage to an RFID tag, the circuit including a pair of antenna input terminals configured to receive an input signal from an RFID tag antenna. A plurality of charge pump stages are coupled in cascade in such a way that an input terminal of a first charge pump stage in the cascade is connected to ground and an input terminal of each subsequent charge pump stage in the cascade is coupled to an output terminal of the preceding charge pump stage in the cascade. A control logic is configured to select the output terminal of one charge pump stage among the plurality of charge pump stages to provide the supply voltage. Furthermore, an RFID tag and a method of providing and limiting a supply voltage to an RFID tag are described.

An integrated resistor-capacitor (RC) structure (400) is disclosed. The integrated RC structure includes a vertical capacitor (302,402,306) and a resistive element (308,310) disposed above the capacitor. The integrated RC structure uses a low ohmic substrate (302) to ensure a good ground return path for the capacitor. Further, a resistivity of the substrate is configured such that a top plate (306) of the capacitor provides a reference ground above a predefined frequency. The impedance of the resistive element (308,310) is matched, relative to the reference ground, to a predetermined resistance. As such, the resistance of the resistive element (308,310) can be controlled to provide an impedance controlled RC structure over a range of operating frequencies.

A non-contact power transmission device equipped with a ground-side device and a vehicle-side device. The ground-side device has a primary-side coil to which alternating-current power is input. The vehicle-side device includes a secondary-side coil, a battery, a secondary-side matching device, and a charging device. The secondary-side coil receives alternating-current power from the primary-side coil in a non-contact manner. The secondary-side matching device is provided between the secondary-side coil and the battery, and has a predetermined fixed inductance and fixed capacitance. The charging device has a switching element that performs a switching operation with a prescribed cycle. The charging device adjusts the duty ratio of the switching operation in accordance with the impedance of a load.

Operational transconductance amplifiers have a natural signal capacity format in which signal performance can be expressed in terms of fixed percentages. Input signal can be applied to Operational transconductance amplifiers in this natural signal capacity format in order to optimize performance. A signal which drives a given Operational transconductance amplifier architecture to produce an output current which is at 50% of it's maximum available output current can be thought of as applying an input voltage which is at 50% of an Operational transconductance amplifier's maximum input voltage capacity. In this input / output channel capacity format, dc offset, distortion, and noise all are temperature independent. By translating input signal between a voltage format to a channel capacity format using the methods of this invention, output signal performance attributes such as gain, frequency response, dc offset, temperature drift, distortion, and noise, can all be optimize over the full temperature range for all types of Operational transconductance amplifier architectures and applications.