A composite resin molded article produced by impregnating cloth made from long fibers of a
liquid crystal polymer with a curable resin composition which comprises a
polymer (A) and a curing agent (B), the
polymer (A) having a weight average molecular weight of 10,000 to 250,000 and containing 5 to 60 mol % of a carboxyl group or a carboxylic anhydride group; a method for manufacturing the composite resin molded article; a cured product produced by curing the composite resin molded article; a laminate made by laminating a substrate having a conductive layer (I) on the surface and an electrical insulating layer made of the cured product; a method for manufacturing the laminate; a multilayer circuit board comprising the laminate and a conductive layer (II) formed on an electrical insulating layer of the laminate; a method for manufacturing the circuit board; and an electronic device having the multilayer circuit board are provided. The composite resin molded article and the cured product thereof have excellent
flame retardancy, electric insulation properties, and
crack resistance, and generates only a very small amount of toxic substances during
incineration. The laminate and multilayer circuit board have a low
thermal expansion and a high modulus of elasticity. The conductive layer (II) exhibits
high adhesion to a smooth electrical insulating layer, even if conductive layer (II) is formed on the electrical insulating layer by a deposition method and thus possesses high reliability. The multilayer circuit board has excellent electrical properties, and therefore can be used suitably as a substrate for a
semiconductor device such as a CPU and memory, as well as other surface-mounted components in electronic devices.