35 results about "Industrial imaging" patented technology

New sensors, pixel detectors and different embodiments of multi-channel integrated circuit are disclosed. The new high energy and spatial resolution sensors use solid state detectors. Each channel or pixel of the readout chip employs low noise preamplifier at its input followed by other circuitry. The different embodiments of the sensors, detectors and the integrated circuit are designed to produce high energy and / or spatial resolution two-dimensional and three-dimensional imaging for different applications. Some of these applications may require fast data acquisition, some others may need ultra high energy resolution, and a separate portion may require very high contrast. The embodiments described herein addresses these issues and also other issues that may be useful in two and three dimensional medical and industrial imaging. The applications of the new sensors, detectors and integrated circuits addresses a broad range of applications such as medical and industrial imaging, NDE and NDI, security, baggage scanning, astrophysics, nuclear physics and medicine.

A method for reconstructing image data from measured sinogram data acquired from a CT system is provided. The CT system is configured for industrial imaging. The method includes pre-processing the measured sinogram data. The pre-processing includes performing a beam hardening correction on the measured sinogram data and performing a detector point spread function (PSF) correction and a detector lag correction on the measured sinogram data. The pre-processed sinogram data is reconstructed to generate the image data.

New sensors and different embodiments of multi-channel integrated circuit are provided. The new high energy and spatial resolution sensors use both solid state and scintillator detectors. Each channel of the readout chip employs low noise charge sensitive preamplifier(s) at its input followed by other circuitry. The different embodiments of the sensors and the integrated circuit are designed to produce high energy and / or spatial resolution two-dimensional and three-dimensional imaging for widely different applications. Some of these applications may require fast data acquisition, some others may need ultra high energy resolution, and a separate portion may require very high contrast. The embodiments described herein addresses all these issues and also other issues that may be useful in two and three dimensional medical and industrial imaging. The applications of the new sensors and integrated circuits addresses a broad range of applications such as medical and industrial imaging, NDE and NDI, security, baggage scanning, astrophysics, nuclear physics and medicine.

A readout electronics scheme is under development for high resolution, compact PET (positron emission tomography) imagers based on LSO (lutetium ortho-oxysilicate, Lu2SiO5) scintillator and avalanche photodiode (APD) arrays. The key is to obtain sufficient timing and energy resolution at a low power level, less than about 30 mW per channel, including all required functions. To this end, a simple leading edge level crossing discriminator is used, in combination with a transimpedance preamplifier. The APD used has a gain of order 1,000, and an output noise current of several pA / √Hz, allowing bipolar technology to be used instead of CMOS, for increased speed and power efficiency. A prototype of the preamplifier and discriminator has been constructed, achieving timing resolution of 1.5 ns FWHM, 2.7 ns full width at one tenth maximum, relative to an LSO / PMT detector, and an energy resolution of 13.6% FWHM at 511 keV, while operating at a power level of 22 mW per channel. Work is in progress towards integration of this preamplifier and discriminator with appropriate coincidence logic and amplitude measurement circuits in an ASIC suitable for a high resolution compact PET instrument. The detector system and / or ASIC can also be used for many other applications for medical to industrial imaging.

An imaging device, including an optical channel, a lens at a distal end of the optical channel, a differentiating element in the optical channel receiving light from the lens and differentiating the light into different wavelengths, a first sensor at a proximal end of the optical channel, a second sensor at the proximal end of the optical channel, the second sensor oriented substantially perpendicular to the first sensor, and a selection element between the first and second sensors receiving the differentiated light from the differentiating element via the optical channel and transmitting a first portion of the differentiated light to the first sensor and a second portion of the differentiated light to the second sensor.

An X-ray sensitive coating (22) for a flat panel direct conversion X-ray detector for medical or industrial imaging. A composite particle-in-binder (PIB) material (22) may contain X-ray photoconductive particles (23) such as PbO (lead monoxide) in a binder of polyimide (23). This PIB material may be prepared in precursor paste form, and applied as a coating (22) onto a thin film transistor array (26) having a storage capacitor (31) at each pixel (30). The coating (22) is cured, and an electrically conducting layer (34) is applied to the exposed surface of the coating (22), to provide a bias voltage. X-ray photons striking the photoconductive particles (23) cause localized electrical conduction proportional to the number of photons. This charges respective capacitors (31) that provide image data input to a computer.

The invention relates to a material mechanical property in-situ three-point bending test platform with adjustable test environment temperature, and belongs to the field of in-situ mechanical property test. Test elements are heated up through resistance wires, and are observed by combining with a high-amplification-factor solid state CCD (charge coupled device) industrial imaging lens, and the microstructure variation as well as micromechanics behaviors of crack production, expanding and the like of materials at different environment temperatures under the bending load effect can be monitored dynamically. The material mechanical property in-situ three-point bending test platform with adjustable test environment temperature provided by the invention mainly comprises a precision driving transmission unit, a detecting unit, an imaging system unit, a temperature field control unit and an auxiliary support unit. The material mechanical property in-situ three-point bending test platform with adjustable test environment temperature has the advantages that the structure is simple and compact, the transmission is stable, and a temperature field and stress field are effectively combined, in-situ observation can be carried out on micro deformation, damage and cracking process of materials under a high-resolution imaging system, and thus a novel test method is provided for revealing the mechanical property and the damage mechanism of materials under different temperature fields.

The invention belongs to the medical and industrial CT (Computed Tomography) imaging technical field and relates to a CT (Computed Tomography) image reconstruction method, a CT (Computed Tomography) image reconstruction system, a terminal and a computer readable storage medium. According to the method, a traditional CT image reconstruction method is adopted to generate an original reconstructed image; artifact removal and noise optimization are performed on the original reconstructed image, part of detail structure data which are lost due to optimization are extracted; characteristic operatorsare obtained by using the optimized original reconstructed image; convolution is performed on the lost detail structure data and the characteristic operators, so that a useful detail structure can beextracted from the lost information; obtained convolution data are added to the optimized original reconstructed image; and finally a CT reconstructed image is obtained. According to the method, structure detail features are retained with artifacts and noises decreased, and therefore, image reconstruction can be performed on complete data, and the obtained CT reconstructed image has very high quality and improved accuracy.

The invention belongs to the technical field of visual measurement, and in particular relates to a method for calibrating the center coordinates of the rotation axis of a swing table. The calibration method includes: adjusting the swing table to the first state, and obtaining an industrial imaging device in the machine coordinate system O-XYZ The first coordinate and the first physical distance of the first coordinate; the swing table is adjusted to the second state, and obtain the second coordinate and the second physical distance of the industrial imaging device in the machine coordinate system O-XYZ; according to the first coordinate, the second coordinate , the first physical distance and the second physical distance are calculated to obtain the center coordinates of the swing axis of the swing table. The invention can accurately calibrate the space coordinates of the origin of the rotation axis of the swing table in the machine coordinate system of the multi-axis vision measurement system. Determining the position of the axis of rotation of the oscillating table helps to improve the measurement accuracy and efficiency of parts with complex shapes, and has great practical application value.