35 results about "Industrial imaging" patented technology

A readout electronics scheme is under development for high resolution, compact PET (positron emission tomography) imagers based on LSO (lutetium ortho-oxysilicate, Lu2SiO5) scintillator and avalanche photodiode (APD) arrays. The key is to obtain sufficient timing and energy resolution at a low power level, less than about 30 mW per channel, including all required functions. To this end, a simple leading edge level crossing discriminator is used, in combination with a transimpedance preamplifier. The APD used has a gain of order 1,000, and an output noise current of several pA / √Hz, allowing bipolar technology to be used instead of CMOS, for increased speed and power efficiency. A prototype of the preamplifier and discriminator has been constructed, achieving timing resolution of 1.5 ns FWHM, 2.7 ns full width at one tenth maximum, relative to an LSO / PMT detector, and an energy resolution of 13.6% FWHM at 511 keV, while operating at a power level of 22 mW per channel. Work is in progress towards integration of this preamplifier and discriminator with appropriate coincidence logic and amplitude measurement circuits in an ASIC suitable for a high resolution compact PET instrument. The detector system and / or ASIC can also be used for many other applications for medical to industrial imaging.

An imaging device, including an optical channel, a lens at a distal end of the optical channel, a differentiating element in the optical channel receiving light from the lens and differentiating the light into different wavelengths, a first sensor at a proximal end of the optical channel, a second sensor at the proximal end of the optical channel, the second sensor oriented substantially perpendicular to the first sensor, and a selection element between the first and second sensors receiving the differentiated light from the differentiating element via the optical channel and transmitting a first portion of the differentiated light to the first sensor and a second portion of the differentiated light to the second sensor.

The invention relates to a material mechanical property in-situ three-point bending test platform with adjustable test environment temperature, and belongs to the field of in-situ mechanical property test. Test elements are heated up through resistance wires, and are observed by combining with a high-amplification-factor solid state CCD (charge coupled device) industrial imaging lens, and the microstructure variation as well as micromechanics behaviors of crack production, expanding and the like of materials at different environment temperatures under the bending load effect can be monitored dynamically. The material mechanical property in-situ three-point bending test platform with adjustable test environment temperature provided by the invention mainly comprises a precision driving transmission unit, a detecting unit, an imaging system unit, a temperature field control unit and an auxiliary support unit. The material mechanical property in-situ three-point bending test platform with adjustable test environment temperature has the advantages that the structure is simple and compact, the transmission is stable, and a temperature field and stress field are effectively combined, in-situ observation can be carried out on micro deformation, damage and cracking process of materials under a high-resolution imaging system, and thus a novel test method is provided for revealing the mechanical property and the damage mechanism of materials under different temperature fields.

The invention belongs to the medical and industrial CT (Computed Tomography) imaging technical field and relates to a CT (Computed Tomography) image reconstruction method, a CT (Computed Tomography) image reconstruction system, a terminal and a computer readable storage medium. According to the method, a traditional CT image reconstruction method is adopted to generate an original reconstructed image; artifact removal and noise optimization are performed on the original reconstructed image, part of detail structure data which are lost due to optimization are extracted; characteristic operatorsare obtained by using the optimized original reconstructed image; convolution is performed on the lost detail structure data and the characteristic operators, so that a useful detail structure can beextracted from the lost information; obtained convolution data are added to the optimized original reconstructed image; and finally a CT reconstructed image is obtained. According to the method, structure detail features are retained with artifacts and noises decreased, and therefore, image reconstruction can be performed on complete data, and the obtained CT reconstructed image has very high quality and improved accuracy.