The invention discloses a defect identification method and device based on multi-
modal data of a
chip preparation process, and the method comprises the steps: obtaining a
graphite carrier image after epitaxial growth is completed, and generating a
graphite carrier and
wafer mapping graph; the method comprises the following steps of: performing multi-
modal imaging on a
wafer to be detected, acquiring a gray scale image, a
reflectivity image and a
photoluminescence intensity image,
synchronizing according to a pixel level, respectively performing normalization
processing, and calculating a physical normalization factor according to a normalization result to obtain a multi-
modal image; constructing a
wafer grid space
database, and storing abnormal areas in the multi-modal image, the electrical
test data and the
graphite carrier image into the wafer grid space
database; and based on the mapped multi-modal image, the electrical
test data and the multi-
source data of the abnormal region in the graphite carrier image, identifying the defect type according to a preset rule. The problem that in the prior art, due to the fact that data generated in the
chip manufacturing process are mutually independent, the defect
root cause analysis efficiency is low is solved.