A
solid-state vacuum
diode comprises a substrate, two sides of the top of the substrate are respectively provided with an
anode and a
cathode, the top of the
anode is provided with an
anode contact layer in
ohmic contact with the anode, the top of the
cathode is provided with a
cathode contact layer in
ohmic contact with the cathode, and a
dielectric layer is arranged between the anode
contact layer and the cathode contact layer. A vacuum area is enclosed among the substrate, the anode, the cathode and the
dielectric layer, or a vacuum area is enclosed among the substrate, the anode, the cathode, the
dielectric layer, the anode contact layer and the cathode contact layer; glass packaging outside a vacuum area of a traditional vacuum
diode is replaced with
solid materials, the defects that glass packaging of the traditional vacuum
diode is poor in reliability and cannot be miniaturized are overcome, meanwhile, a carrier transport area of a traditional all-
solid-state
semiconductor diode is vacuumized, and the problem that the carrier movement of a solid-state diode is scattered, so that microminiaturization cannot be achieved is solved. According to the solid-state diode, the unlimited movement of current carriers is combined with the microminiaturization of a solid-
state structure, so that the conversion power of the solid-state diode is improved.