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This invention relates to a substrate support unit and a substrate processing apparatus including the same. The object of this invention is to provide a focusing ring, a substrate support unit including the same, and a substrate processing apparatus that improves the problem of plasma sheath shape change that occurs simultaneously with focusing ring wear during substrate processing. The substrate support unit of this invention is disposed inside a cavity body of a plasma-processed substrate to hold the substrate. The substrate support unit is characterized by comprising: an electrostatic chuck for adsorbing the substrate; and a focusing ring disposed on the electrostatic chuck to surround the substrate, the focusing ring comprising a phase change material that changes phase according to temperature.