32results about How to "Arrangement structure optimization" patented technology

Disclosed herein is an LED package for a backlight unit. The LED package includes a plurality of LEDs, a die bonding part, a wire bonding part and a body. The die bonding part, on which the plurality of LEDs is arranged, allows the first electrodes of the LEDs to be electrically connected to an external circuit. The wire bonding part is spaced apart from the die bonding part by a predetermined distance to be insulated from the die bonding part and allows the second electrodes of the LEDs to be electrically connected to the external circuit so that the LEDs are operated. The body has a molding cup which is used to fill a space above the LEDs with transparent resin and a base on which the die bonding part and the wire bonding part are arranged.

The invention discloses a display panel and a pixel structure thereof. The display panel is formed by repeatedly stacking a plurality of display units. Each display unit is formed by arranging and combining a plurality of sub-pixels. The arrangement structure of the sub-pixels is of a 4*4 arrangement. According to the arrangement, a sub-pixel b, a sub-pixel d, a sub-pixel a and a sub-pixel d are sequentially arranged in the first line from left to right, a sub-pixel d, a sub-pixel c, a sub-pixel b and a sub-pixel c are sequentially arranged in the second line from left to right, a sub-pixel a, a sub-pixel b, a sub-pixel d and a sub-pixel b are sequentially arranged in the third line from left to right, a sub-pixel d, a sub-pixel c, a sub-pixel b and a sub-pixel a are sequentially arranged in the fourth line from left to right, and the sub-pixels a, the sub-pixels b, the sub-pixels c and the sub-pixels d are the sub-pixels different in colors.

A plug connector assembly includes: a cable; a printed circuit board including a mating end for inserting into a mating connector, a connecting end electrically connected with the cable, and an intermediate portion between the mating end and the connecting end, the mating end defining plural conductive pads extending along a longitudinal direction of the printed circuit board for electrically connecting with the mating connector and arranged in a horizontal direction perpendicular to the longitudinal direction; and an outer case enclosing the intermediate portion of the printed circuit board and a part of the cable; wherein the intermediate portion defines on each of two side edges thereof a recessing portion filled by the outer case.

Embodiments of the present disclosure relate to a touch display device, and more particularly, to a touch display device which can have a small bezel size even when touch routing lines connecting a touch sensor to a touch sensing circuit are disposed in a non-display area and which can improve touch sensitivity by preventing or minimizing the formation of parasitic capacitance that can be caused by the touch routing lines.

The invention discloses a method for manufacturing a low-temperature polysilicon display panel. The method comprises the steps of: a vacuum environment providing step: providing a vacuum environment;a substrate providing step: providing a glass substrate; a step of forming a next silicon oxide layer: forming the next silicon oxide layer on the glass substrate; a step of forming a silicon nitridelayer: comprising forming a silicon nitride layer on the next silicon oxide layer; a step of forming of a last silicon monoxide layer: forming a last silicon monoxide layer on the silicon nitride layer; a noncrystalline silicon forming step: forming a noncrystalline silicon layer on the last silicon monoxide layer in the vacuum environment; a protection layer forming step: forming a protection layer on the noncrystalline silicon layer; and an annealing step: performing quasimolecule laser annealing for the noncrystalline silicon layer to form polycrystalline silicon on the noncrystalline silicon layer. The method for manufacturing a low-temperature polysilicon display panel avoids the problem that the generated polycrystalline silicon crystal lattice is defective due to residual airborne particles or metal ions on the amorphous silicon layer.

An optical pickup actuator which includes a base, a blade having an objective lens mounted thereon, a plurality of suspensions supporting the blade to be movable with respect to the base and forming an electroconductive path, and a magnetic circuit driving the blade according to a driving signal applied through the respective suspensions. The magnetic circuit includes a magnet fixed to the base, and a fine pattern coil installed on the blade at a position facing the magnet and having a track pattern coil, a focus pattern coil, and a tilt pattern coil independently driven by current applied through the suspensions and providing driving forces in a track direction, a focus direction, and a tilt direction of the blade.

The invention discloses a waterproof combined power supply with an optimized solar panel structure in flight mode, which relates to the technical field; a solar weak light intelligent conversion circuit is electrically connected with an optimized unit structure, and the optimized unit structure consists of five large independent large unit modules It is connected in parallel, and then five sub-units in each independent No. 1 large unit meet the voltage output and are connected in series. The arrangement of the small units is five groups, and the five independent sub-groups are connected in parallel to form a large unit. unit; the invention optimizes the solar panel unit arrangement structure, which is more suitable for portable products, more reliable and stable; improves the adaptability of solar panel power generation products; makes more intelligent and effective use of weak light power, and uses a power management method with lower loss.

A calculation method for improving the pixel arrangement structure of visual resolution, comprising the following steps: at the physical pixel points of each color; connecting the center points of adjacent physical pixel points with straight lines, so that the center points of abstract pixel points are uniform Fall on the grid composed of straight lines; extract physical pixel points X of any color, and the midpoints of these pixels fall on the grid, take any pixel point X as the central pixel point, and find a surrounding pixel point consisting of The polygon with the largest area formed by the center of other pixel points; the average value of the distance from the dominant pixel to the center pixel is defined, which is called visual resolution VR; the present invention also provides a pixel arrangement structure obtained according to the above calculation method. This kind of arrangement structure greatly increases the resolution of the image synthesized by the display, and improves the sensory effect of the human eye on the display; at the same time, the imaging brightness of the display is uniform, and will not cause strong stimulation and damage to the human eye.

A ventilator for a casting mold is mounted on an exhaust pipe (11) of a mold (10) to emit gas generated when melt is injected into a molding space (12). The ventilator for a casting mold has exhaust holes which are improved in arrangement structure and are shorter than a cylindrical body part so as to enhance gas emission efficiency and prevent transformation of the exhaust holes, and has a buffering space part formed inside a cylindrical body part to spread and accept melt coming through the exhaust holes so as to effectively prevent a damage of a mold caused by external leakage of the melt. The ventilator for the casting mold includes a cylindrical body part (100) and a fixed type exhaust block (20).

The invention discloses an integrated impedance-loaded sound surface wave gas sensor based on a Si (silicon) substrate. The integrated impedance-loaded sound surface wave gas sensor comprises a substrate, a piezoelectric layer, an input / output interdigital transducer, a reflective interdigital transducer, a sensitive interdigital electrode and a gas-sensitive thin film. The integrated impedance-loaded sound surface wave gas sensor has the advantages that by growing one thin SiO2 (silicon dioxide) insulation layer and one piezoelectric layer on the Si substrate, the good temperature characteristic is realized; the material of the Si substrate has the characteristics of low cost, large size and conductivity, and can be combined with the integrated circuit industry; the arrangement structure of the interdigital electrode is optimized, the sound wave reflection caused by the external sensor is reduced, and the parasitic effect caused by connecting wires is reduced; the interdigital transducer and the sensitive interdigital electrode are manufactured by one step, so that the simplicity in the manufacturing process is guaranteed, and the large-scale production is easily realized; the wireless passive measuring of the sensor is realized, the sensing part which is easily influenced by outside is separated from a signal sending part, and the application range of the sensor is widened.