31results about How to "Easily and accurately formed" patented technology

A processing method of a polishing pad for semiconductor wafer capable of forming a groove, a concave portion, a through hole and the like having a small surface roughness of the inner surface of the groove and the like of 20 mum or less, a high dimensional accuracy and a uniform cross-sectional shape, and a polishing pad for semiconductor wafer. In the processing method, a surface of a polishing pad including a water-insoluble matrix containing a crosslinked polymer and a water-soluble particle dispersed in the water-insoluble matrix is processed by cutting and the like. Additionally, when a groove and the like are formed, it is preferable that a polishing pad is placed on one surface side of a machining table having a sucking hole, the pad is fixed on the one surface side of the machining table by vacuuming sucking it from the other surface of the machining table, and then a groove and the like are formed.

An ultrasonic transducer includes a resin substrate, a support film and a piezoelectric element. The resin substrate has an opening. The support film blocks off the opening in the resin substrate. The piezoelectric element is disposed on the support film in a region that blocks off the opening in plan view from a thickness direction of the support film. The piezoelectric element includes a lamination of a lower electrode, a piezoelectric body, and an upper electrode.

A novel diarylamine novolac resin such as a phenylnaphthylamine novolac resin, and further a resist underlayer film-forming composition in which the resin is used in a lithography process for manufacturing a semiconductor device. A polymer including a unit structure (A) of Formula (1):

(in Formula (1), each of Ar¹ and Ar² is a benzene ring or a naphthalene ring). A method for manufacturing a semiconductor device, including: forming an underlayer film on a semiconductor substrate with the resist underlayer film-forming composition; forming a hardmask on the underlayer film; forming a resist film on the hardmask; forming a resist pattern by irradiation with light or an electron beam followed by development; etching the hardmask with the resist pattern; etching the underlayer film with the hardmask thus patterned; and processing the semiconductor substrate with the underlayer film thus patterned.

A semiconductor substrate (1) comprising an SOI (2) formed therein. The semiconductor substrate (1) comprises first and second wafers (4,6) which are directly bonded together along a bond interface (9). Prior to bonding the wafers (4,6), a portion (15) of the second wafer (6) is ion implanted to form a p+ region for facilitating selective etching thereof to form a buried cavity (16), in which a buried insulating layer is subsequently formed under a portion (10) of the first wafer (4) for forming the SOI (2). After bonding of the first and second wafers (4,6) a communicating opening (20) is etched through the first wafer (4) to the bond interface (9), and the selectively etchable portion (15) is etched through the communicating opening (20) to form the buried cavity (16). The buried cavity (16) is then filled with deposited oxide to form the buried insulating layer (11). An isolation trench (12) is formed through the first wafer (4) to the buried insulating layer (11) around the portion (10) for isolating the SOI (2) from the remainder of the first wafer (4).

An optical waveguide device including a substrate; a light emitting element provided on a light emitting element provision region of an upper surface of the substrate; an under-cladding layer provided on a portion of the upper surface of the substrate except for the light emitting element provision region; and a core covering the light emitting element and the under-cladding layer on the substrate, and serving as a path of light emitted from the light emitting element. An optical waveguide device manufacturing method including the steps of: forming an under-cladding layer on a portion of an upper surface of a substrate except for the light emitting element provision region; placing a light emitting element on the light emitting element provision region; and forming a core on the resultant substrate to cover the light emitting element and the under-cladding layer.

In a semiconductor device cooling apparatus which cools a semiconductor device uniformly with a simple structure, a coolant is supplied from a supply port to the center of a heat transmission plate on which a semiconductor device is disposed in intimate contact therewith, is radially flown toward the peripheral edge portion of the heat transmission plate through a gap-shaped flow path which is formed by a gap forming plate composed of two thin plate members of a gap interval plate acting as a spacer and a gap top plate disposed on the gap interval plate and has a small height, is collected by a collection groove formed around the peripheral edge portion, and is discharged from a discharge port.

On a multilayer film formed on a lower electrode layer, a resist layer having cutaway parts at a lower portion is formed, and on parts of the upper surface of the multilayer film which are not overlapped with the resist layer except for areas inside the cutaway parts, first gap layers are formed. Accordingly, a predetermined gap T1 can be formed between the first gap layers in the track width direction. Next, in the following step, two end surfaces of the multilayer film and the first gap layers in the track width direction are milled. Hence, according to the present invention, compared to the case in the past, the predetermined gap T1 provided between the first gap layers can be formed into a minute size with superior accuracy, the current path-squeezing structure can be easily formed, and a magnetic sensor having superior change in resistance (ΔR) and reproduction output can be manufactured.

A sheet-supply cassette including a main member which is open upward and which is adapted to store a plurality of recording sheets which are stacked on each other and each one of which is separated from the other recording sheets, and is fed in a sheet-feed direction, by a sheet feeder; an inclined sheet-separate plate which is provided in a downstream-side portion of the main member as seen in the sheet-feed direction, and which cooperates with the sheet feeder to separate the each recording sheet from the other recording sheets; and a plurality of back-surface support portions which are formed integrally with the downstream-side portion of the main member, such that the back-surface support portions are distant from each other in a perpendicular direction substantially perpendicular to the sheet-feed direction. The inclined sheet-separate plate is detachably attached to the back-surface support portions such that a back surface of the inclined sheet-separate plate is supported by the back-surface support portions.

A liquid ejection head including: a head main body including: a cavity unit including a passage forming base plate forming a liquid passage from a common liquid chamber to a nozzle opening via a pressure chamber; and a pressure generating source generating a change of pressure of liquid in the pressure chamber to eject the liquid in the pressure chamber as a liquid droplet from the nozzle opening; and a case member to which the head main body is attached and which includes: a first member provided with a first atmosphere opening passage; and a second member laminated on the first member and provided with a second atmosphere opening passage, wherein the first and second atmosphere opening passages communicate with each other under the laminated state and are opened to atmosphere.

The protective electronic prototyping enclosure is conveniently formed to accommodate various prototype electronic projects. Openings in the enclosure may be accurately formed and markings can be neatly and precisely formed by on a paper label printed by using the computer. Variable panels are provided for covering spaces between electrical components located adjacent to the side panels of the enclosure.

In a laser processing mask, apertures formed thereon as laser light passing apertures are shaped so that a plurality of protrusions extend radially from the center of each of the apertures to the peripheral portion thereof. By using this laser processing mask, a recess pattern with dimensions of several micrometers to several tens of micrometers and high dimensional precision and shape precision can be formed on the surface of a workpiece made of, for example, a metal material by laser processing.

A recording method includes a method for recording a glossy image on a recording medium of which a recording surface includes a recording portion having the glossy image recorded and a non-recording portion having the glossy image non-recorded. The method includes the steps of attaching a resin-containing masking composition to the non-recording portion; attaching an adhesive composition to the recording portion by an ink jet method; bringing the recording medium into contact with a glossy film-formed sheet such that the recording surface of the recording medium faces the glossy film-formed surface of the sheet, heating the adhesive composition; and peeling off the recording medium and the sheet.

A linear motion actuator is provided of which the output member can be smoothly moved linearly even when lateral moment acts on the output member. A carrier (6) supporting planetary rollers (7) is axially immovable, while an outer ring member (5), as the output member, is axially slidably fitted in the radially inner surface of a cylindrical portion (1a) of a housing (1), and is rotationally fixed to a driven member through keys (22). Hard plating layers are formed on the radially outer surface of a rotary shaft (4), the radially outer surfaces of the planetary rollers (7), including helical grooves (7a), and the surface of a helical rib member (5b) which is fixed to the radially inner surface of the outer ring member (5) forming a helical rib.

A plasma display panel, including: a first substrate; a second substrate; barrier ribs partitioning a space between the first and second substrates to define discharge cells; address electrodes extending along a first direction to correspond to the discharge cells on a surface of the first substrate and covered with a first dielectric layer; first and second electrodes extending along a second direction crossing the first direction on a surface of the second substrate to define a discharge gap at centers of the discharge cells and covered with a second dielectric layer; and a guide portion that corresponds to at least a part of the discharge gap, wherein the second dielectric layer includes, a first dielectric layer section inside a space defined by the guide portion, and a second dielectric layer section on the first dielectric layer section, and wherein a first dielectric constant is smaller than a second dielectric constant.

The occurrence of a positional shift of a semiconductor chip during resin sealing is suppressed; and a redistribution layer is easily and accurately formed. A semiconductor device according to the present invention is provided with: a substrate which is formed of a cured thermosetting resin, and which has one or more recesses; a circuit element which is arranged within a recess of the substrate; and a redistribution layer which is connected to the circuit element on the opening side of the recess.