31results about How to "Easily and accurately formed" patented technology

A slot antenna apparatus 10 contains a circuit substrate having a high-frequency circuit arranged therein and a shield case accommodating the circuit substrates. A cross-shaped slot and a feeding pin are formed in an upper plate of the shield case. The cross-shaped slot is composed of a first and second slots. The lengths of the slots are different and the slots are perpendicular to each other. The shortest distances from the feeding pin to the first slots are approximately equal. When the power is fed to the upper plate through the feeding pin, the slots are excited to irradiate linearly polarized waves perpendicular to each other, respectively.

A processing method of a polishing pad for semiconductor wafer capable of forming a groove, a concave portion, a through hole and the like having a small surface roughness of the inner surface of the groove and the like of 20 mum or less, a high dimensional accuracy and a uniform cross-sectional shape, and a polishing pad for semiconductor wafer. In the processing method, a surface of a polishing pad including a water-insoluble matrix containing a crosslinked polymer and a water-soluble particle dispersed in the water-insoluble matrix is processed by cutting and the like. Additionally, when a groove and the like are formed, it is preferable that a polishing pad is placed on one surface side of a machining table having a sucking hole, the pad is fixed on the one surface side of the machining table by vacuuming sucking it from the other surface of the machining table, and then a groove and the like are formed.

An ultrasonic transducer includes a resin substrate, a support film and a piezoelectric element. The resin substrate has an opening. The support film blocks off the opening in the resin substrate. The piezoelectric element is disposed on the support film in a region that blocks off the opening in plan view from a thickness direction of the support film. The piezoelectric element includes a lamination of a lower electrode, a piezoelectric body, and an upper electrode.

A display device having a plurality of pixels and which realizes a color display with emitted light of at least two wavelengths wherein each pixel has a microresonator structure between a lower reflective film formed on a side near a substrate and an upper reflective film formed above the lower reflective film with an organic light emitting element layer therebetween. The lower reflective film is made of a metal thin film and a conductive resonator spacer layer which functions as a first electrode is provided between the lower reflective film and the organic light emitting element layer. A thickness of the conductive resonator spacer layer is changed by changing a number of layers or a number of remaining layers of transparent conductive metal oxide layers made of ITO corresponding to pixels of different light emission wavelengths. An amorphous ITO layer at an upper layer is selectively removed from above a polycrystalline ITO layer at a lower layer using the polycrystalline ITO layer as an etching stopper so that the thickness is changed corresponding to the thickness of the ITO layer to be formed and not removed. Light obtained in the organic light emitting element layer is intensified by the microresonator structure in which the optical length is adjusted by the conductive resonator spacer layer and is emitted to the outside.

A novel diarylamine novolac resin such as a phenylnaphthylamine novolac resin, and further a resist underlayer film-forming composition in which the resin is used in a lithography process for manufacturing a semiconductor device. A polymer including a unit structure (A) of Formula (1):(in Formula (1), each of Ar1 and Ar2 is a benzene ring or a naphthalene ring). A method for manufacturing a semiconductor device, including: forming an underlayer film on a semiconductor substrate with the resist underlayer film-forming composition; forming a hardmask on the underlayer film; forming a resist film on the hardmask; forming a resist pattern by irradiation with light or an electron beam followed by development; etching the hardmask with the resist pattern; etching the underlayer film with the hardmask thus patterned; and processing the semiconductor substrate with the underlayer film thus patterned.

A semiconductor substrate (1) comprising an SOI (2) formed therein. The semiconductor substrate (1) comprises first and second wafers (4,6) which are directly bonded together along a bond interface (9). Prior to bonding the wafers (4,6), a portion (15) of the second wafer (6) is ion implanted to form a p+ region for facilitating selective etching thereof to form a buried cavity (16), in which a buried insulating layer is subsequently formed under a portion (10) of the first wafer (4) for forming the SOI (2). After bonding of the first and second wafers (4,6) a communicating opening (20) is etched through the first wafer (4) to the bond interface (9), and the selectively etchable portion (15) is etched through the communicating opening (20) to form the buried cavity (16). The buried cavity (16) is then filled with deposited oxide to form the buried insulating layer (11). An isolation trench (12) is formed through the first wafer (4) to the buried insulating layer (11) around the portion (10) for isolating the SOI (2) from the remainder of the first wafer (4).

A display device includes a plurality of spacer rows that are provided outside a display region on one of a pair of substrates, and each of the spacer rows is defined by a plurality of spacers arranged in a row at predetermined intervals along an outer edge of the display region. Each spacer has a substantially elongated shape extending along the outer edge of the display region. A gap between adjacent spacers in each spacer row is defined by a slit portion having a shorter length than a longitudinal length of the spacer, and the plurality of spacer rows are entirely covered by the seal member between the pair of substrates.

A slot antenna apparatus 10 contains a circuit substrate having a high-frequency circuit arranged therein and a shield case accommodating the circuit substrate. A cross-shaped slot and a feeding pin are formed in an upper plate of the shield case. The cross-shaped slot is composed of first and second slots. The lengths of the slots are different and the slots are perpendicular to each other. The shortest distances from the feeding pin to the first slots are approximately equal. When the power is fed to the upper plate through the feeding pin, the slots are excited to irradiate linearly polarized waves perpendicular to each other, respectively.

A light emitting module includes: a semiconductor light emitting element; a plate-shaped light wavelength conversion ceramic that is provided so as to face the light emitting surface of the semiconductor light emitting element and that is configured to convert the wavelength of the light, which has been emitted by the semiconductor light emitting element; and a reflective film that is formed on the surface of the light wavelength conversion ceramic and that is configured to shield part of the light, which has been transmitted through the light wavelength conversion ceramic. The light wavelength conversion ceramic is composed on an inorganic material.

An optical waveguide device including a substrate; a light emitting element provided on a light emitting element provision region of an upper surface of the substrate; an under-cladding layer provided on a portion of the upper surface of the substrate except for the light emitting element provision region; and a core covering the light emitting element and the under-cladding layer on the substrate, and serving as a path of light emitted from the light emitting element. An optical waveguide device manufacturing method including the steps of: forming an under-cladding layer on a portion of an upper surface of a substrate except for the light emitting element provision region; placing a light emitting element on the light emitting element provision region; and forming a core on the resultant substrate to cover the light emitting element and the under-cladding layer.

In a semiconductor device cooling apparatus which cools a semiconductor device uniformly with a simple structure, a coolant is supplied from a supply port to the center of a heat transmission plate on which a semiconductor device is disposed in intimate contact therewith, is radially flown toward the peripheral edge portion of the heat transmission plate through a gap-shaped flow path which is formed by a gap forming plate composed of two thin plate members of a gap interval plate acting as a spacer and a gap top plate disposed on the gap interval plate and has a small height, is collected by a collection groove formed around the peripheral edge portion, and is discharged from a discharge port.

A light emitting module includes: a semiconductor light emitting element; a plate-shaped light wavelength conversion ceramic that is provided so as to face the light emitting surface of the semiconductor light emitting element and that is configured to convert the wavelength of the light, which has been emitted by the semiconductor light emitting element; and a reflective film that is formed on the surface of the light wavelength conversion ceramic and that is configured to shield part of the light, which has been transmitted through the light wavelength conversion ceramic. The light wavelength conversion ceramic is composed on an inorganic material.

On a multilayer film formed on a lower electrode layer, a resist layer having cutaway parts at a lower portion is formed, and on parts of the upper surface of the multilayer film which are not overlapped with the resist layer except for areas inside the cutaway parts, first gap layers are formed. Accordingly, a predetermined gap T1 can be formed between the first gap layers in the track width direction. Next, in the following step, two end surfaces of the multilayer film and the first gap layers in the track width direction are milled. Hence, according to the present invention, compared to the case in the past, the predetermined gap T1 provided between the first gap layers can be formed into a minute size with superior accuracy, the current path-squeezing structure can be easily formed, and a magnetic sensor having superior change in resistance (ΔR) and reproduction output can be manufactured.

A liquid ejection head including: a head main body including: a cavity unit including a passage forming base plate forming a liquid passage from a common liquid chamber to a nozzle opening via a pressure chamber; and a pressure generating source generating a change of pressure of liquid in the pressure chamber to eject the liquid in the pressure chamber as a liquid droplet from the nozzle opening; and a case member to which the head main body is attached and which includes: a first member provided with a first atmosphere opening passage; and a second member laminated on the first member and provided with a second atmosphere opening passage, wherein the first and second atmosphere opening passages communicate with each other under the laminated state and are opened to atmosphere.

A sheet-supply cassette including a main member which is open upward and which is adapted to store a plurality of recording sheets which are stacked on each other and each one of which is separated from the other recording sheets, and is fed in a sheet-feed direction, by a sheet feeder; an inclined sheet-separate plate which is provided in a downstream-side portion of the main member as seen in the sheet-feed direction, and which cooperates with the sheet feeder to separate the each recording sheet from the other recording sheets; and a plurality of back-surface support portions which are formed integrally with the downstream-side portion of the main member, such that the back-surface support portions are distant from each other in a perpendicular direction substantially perpendicular to the sheet-feed direction. The inclined sheet-separate plate is detachably attached to the back-surface support portions such that a back surface of the inclined sheet-separate plate is supported by the back-surface support portions.

A liquid ejection head including: a head main body including: a cavity unit including a passage forming base plate forming a liquid passage from a common liquid chamber to a nozzle opening via a pressure chamber; and a pressure generating source generating a change of pressure of liquid in the pressure chamber to eject the liquid in the pressure chamber as a liquid droplet from the nozzle opening; and a case member to which the head main body is attached and which includes: a first member provided with a first atmosphere opening passage; and a second member laminated on the first member and provided with a second atmosphere opening passage, wherein the first and second atmosphere opening passages communicate with each other under the laminated state and are opened to atmosphere.

The protective electronic prototyping enclosure is conveniently formed to accommodate various prototype electronic projects. Openings in the enclosure may be accurately formed and markings can be neatly and precisely formed by on a paper label printed by using the computer. Variable panels are provided for covering spaces between electrical components located adjacent to the side panels of the enclosure.

In a laser processing mask, apertures formed thereon as laser light passing apertures are shaped so that a plurality of protrusions extend radially from the center of each of the apertures to the peripheral portion thereof. By using this laser processing mask, a recess pattern with dimensions of several micrometers to several tens of micrometers and high dimensional precision and shape precision can be formed on the surface of a workpiece made of, for example, a metal material by laser processing.

A recording method includes a method for recording a glossy image on a recording medium of which a recording surface includes a recording portion having the glossy image recorded and a non-recording portion having the glossy image non-recorded. The method includes the steps of attaching a resin-containing masking composition to the non-recording portion; attaching an adhesive composition to the recording portion by an ink jet method; bringing the recording medium into contact with a glossy film-formed sheet such that the recording surface of the recording medium faces the glossy film-formed surface of the sheet, heating the adhesive composition; and peeling off the recording medium and the sheet.

A linear motion actuator is provided of which the output member can be smoothly moved linearly even when lateral moment acts on the output member. A carrier (6) supporting planetary rollers (7) is axially immovable, while an outer ring member (5), as the output member, is axially slidably fitted in the radially inner surface of a cylindrical portion (1a) of a housing (1), and is rotationally fixed to a driven member through keys (22). Hard plating layers are formed on the radially outer surface of a rotary shaft (4), the radially outer surfaces of the planetary rollers (7), including helical grooves (7a), and the surface of a helical rib member (5b) which is fixed to the radially inner surface of the outer ring member (5) forming a helical rib.

A guide device for cutting lap joints includes a frame and a rectilinear guide member, the frame having a Y-like shape and consisting of a removable top portion and a bottom portion forming a yoke therebetween at the upper portion of the Y-like frame. The lower portion of the Y-like frame has a guide portion and one side of the guide portion extends to be co-linear with one side of the yoke portion forming a first adjustable guide surface. The guide portion is provided with a guide way running longitudinally along the guide portion with a movable stopper provided so as to move along the guide surface as guided by the guide way. The movable stopper has a lockable member for locking the movable stopper in any desired position along said guide surface. The other side of the guide portion opposite to the guide surface forms an angle of 45 degrees with another contiguous side of the yoke portion and a fixed stopper is formed near the junction of the yoke portion and this other side of the guide portion. The rectilinear guide member is removably inserted within the yoke, extending perpendicular to the adjustable guide surface, a bottom edge thereof forming a 45 degree angle with said fixed stopper.

A charged particle beam apparatus includes a sample stage, a focused ion beam column, a scattered electron detector that detects backscattered electrons generated from a cross-section of a sample, a crystal orientation information generation unit that generates crystal orientation information on a predetermined region of the cross-section, and an angle calculation unit that calculates attachment angles of the sample stage, corresponding to a direction of the cross-section. In response to receiving input of information indicating that the crystal orientation information on the region displayed on a display unit is changed to aimed second crystal orientation information, the angle calculation unit calculates the attachment angles corresponding to the direction of the cross-section for generating the second crystal orientation information, and the focused ion beam column performs etching processing on the cross-section at the calculated attachment angles.

A sheet-supply cassette including a main member which is open upward and which is adapted to store a plurality of recording sheets which are stacked on each other and each one of which is separated from the other recording sheets, and is fed in a sheet-feed direction, by a sheet feeder; an inclined sheet-separate plate which is provided in a downstream-side portion of the main member as seen in the sheet-feed direction, and which cooperates with the sheet feeder to separate the each recording sheet from the other recording sheets; and a plurality of back-surface support portions which are formed integrally with the downstream-side portion of the main member, such that the back-surface support portions are distant from each other in a perpendicular direction substantially perpendicular to the sheet-feed direction. The inclined sheet-separate plate is detachably attached to the back-surface support portions such that a back surface of the inclined sheet-separate plate is supported by the back-surface support portions.

A plasma display panel, including: a first substrate; a second substrate; barrier ribs partitioning a space between the first and second substrates to define discharge cells; address electrodes extending along a first direction to correspond to the discharge cells on a surface of the first substrate and covered with a first dielectric layer; first and second electrodes extending along a second direction crossing the first direction on a surface of the second substrate to define a discharge gap at centers of the discharge cells and covered with a second dielectric layer; and a guide portion that corresponds to at least a part of the discharge gap, wherein the second dielectric layer includes, a first dielectric layer section inside a space defined by the guide portion, and a second dielectric layer section on the first dielectric layer section, and wherein a first dielectric constant is smaller than a second dielectric constant.

The protective electronic prototyping enclosure is conveniently formed to accommodate various prototype electronic projects. Openings in the enclosure may be accurately formed and markings can be neatly and precisely formed by on a paper label printed by using the computer. Variable panels are provided for covering spaces between electrical components located adjacent to the side panels of the enclosure.

A balance shaft structure includes a balance shaft including a balance weight, a driven gear to rotate the balance shaft by being engaged with a drive gear, a scissors mechanism, whose position in an axial direction is regulated, including a scissors gear to reduce backlash between the drive gear and the driven gear and an axially urging member to urge the scissors gear toward the driven gear in the axial direction, a first regulating portion to regulate an axially inner position of the scissors mechanism, and a second regulating portion fixed to the balance shaft on a side close to the shaft end part of the balance shaft beyond the first regulating portion and configured to regulate an axially outer position of the scissors mechanism.

The occurrence of a positional shift of a semiconductor chip during resin sealing is suppressed; and a redistribution layer is easily and accurately formed. A semiconductor device according to the present invention is provided with: a substrate which is formed of a cured thermosetting resin, and which has one or more recesses; a circuit element which is arranged within a recess of the substrate; and a redistribution layer which is connected to the circuit element on the opening side of the recess.

A balance shaft structure includes a balance shaft including a balance weight, a driven gear to rotate the balance shaft by being engaged with a drive gear, a scissors mechanism, whose position in an axial direction is regulated, including a scissors gear to reduce backlash between the drive gear and the driven gear and an axially urging member to urge the scissors gear toward the driven gear in the axial direction, a first regulating portion to regulate an axially inner position of the scissors mechanism, and a second regulating portion fixed to the balance shaft on a side close to the shaft end part of the balance shaft beyond the first regulating portion and configured to regulate an axially outer position of the scissors mechanism.