PROBLEM TO BE SOLVED: To provide a substrate transport device which can sufficiently remove deposited particles without deteriorating an operation ratio of a substrate processing system.
SOLUTION: The substrate transport device 10 is provided with a chamber 11 in a box shape, a transport arm 12 disposed in the chamber 11, an exhaust line 15 exhausting inside of the chamber 11 and a gas introduction line 18 introducing N<SB>2</SB>gas into the chamber 11. The transport arm 12 moves a pick having an electrode layer to which high voltage is applied to the desired position of the chamber 11. N<SB>2</SB>gas is introduced into the chamber 11 by the gas introduction line 18, inside of the chamber 11 is exhausted by the exhaust line 15 and a viscous flow is generated in the chamber 11. High voltage is applied to the electrode layer of the pick moved to the desired position. Thus, an electrostatic field is generated between the inner face of the chamber 11 and the pick, and electrostatic stress is operated on the inner face of the chamber 11 where the particles are deposited.
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