Provided is an Sb—Te
alloy sintered compact target using atomized
powder consisting of substantially spherical particles of an Sb—Te
alloy, wherein the spherical atomized
powder consists of particles that were crushed and flattened, and the flattened particles exhibiting a ratio (flatness ratio) of
short axis and
long axis of 0.6 or less occupy 50% or more of the overall particles. With this Sb—Te
alloy sintered compact target, particles exhibiting a
long axis orientation aligned within ±45° in a direction that is parallel to the
target surface occupy 60% or more of the overall particles. In addition, the
oxygen concentration in this Sb—Te alloy sintered compact target is 1500 wtppm or less. Thus, the Sb—Te alloy
sputtering target structure can be uniformalized and refined, generation of cracks in the sintered target can be inhibited, and generation of arcing during
sputtering can be inhibited. Further, surface ruggedness caused by sputter
erosion can be reduced in order to obtain a high quality Sb—Te alloy
sputtering target.