1results about How to "Stable throughput" patented technology

This application provides a monolithic 3D integrated chip, relating to the field of semiconductor technology, primarily addressing the problem that current resistive random access memory (RRAM)-based logic architectures remain relatively fixed and lack flexible reconfigurability. The monolithic 3D integrated chip includes a logic layer, a memory computing layer, and a reconfigurable layer stacked sequentially, with interconnections between these layers. The logic layer transmits computation signals and data to the memory computing layer and configuration data and signals to the reconfigurable layer. The memory computing layer, under the control of the computation signals, performs matrix multiplication or addition on the computation data and outputs the computation results. The reconfigurable layer, under the control of the configuration signals, performs reconfigurable processing on the computation results according to the configuration data. This application endows the chip with flexible programmability and reconfigurability.