144results about How to "Coupling stability" patented technology

A case for a bar type mobile electronic device is provided. The case includes a main body and an auxiliary body. The main body includes a periphery part and guide parts. The periphery part wraps the sides of the mobile electronic device. The guide parts cover parts of the front and back of the mobile electronic device. The guide parts are extended in the direction where the mobile electronic device is located at both opposite edges of the periphery part. The auxiliary body wraps the outer surface of the periphery part. The auxiliary body applies pressure to the main body in the direction of the mobile electronic device. The auxiliary body assists the main body to couple to the mobile electronic device, so that the case cannot be easily removed from the mobile electronic device and can protect the mobile electronic device from scratches and external impact.

The invention discloses a welding wire sending and pulverized solder sending laser cladding forming method. The method is characterized in that a conscope is used to change a solid laser beam transmitted by a laser to an annular light beam through light path transformation, then an annular focus lens is used to focus the annular light beam to an annular conical light beam, a hollow conical aphotic zone is formed in the annular conical light beam, a welding wire sending and pulverized solder sending protective gas composite nozzle is arranged in the aphotic zone and has the same axis of the annular conical light beam, a welding wire sending hole is arranged in the center, parallel pulverized solder sending holes are around the welding wire sending hole, collimating protective gas holes are parallel to and around the pulverized solder sending holes, wire is sent to a molten pool through the welding wire sending hole along the axial direction of the light beam and vertically to a machining face, airborne pulverized solder is sent to the molten pool through the pulverized solder sending holes at the same time, and collimating protective gas surrounds the welding wire and pulverized solder and is blown to the molten pool. The invention adopts the welding wire sending and pulverized solder sending protective gas composite nozzle to realize welding wire, pulverized solder and protective gas composite cladding and solve the defects of the prior art.

An organic light emitting diode (OLED) display and a method of manufacturing the same are provided. The OLED display includes: a display panel assembly including a first substrate having a display area and a mounting area, a second substrate coupled to the display area of the first substrate, and an integrated circuit chip mounted in the mounting area of the first substrate; a cover window disposed opposite the second substrate and the integrated circuit chip and covering the display panel assembly; and an adhesive layer which fills up a space between the second substrate and the cover window, and a space between the mounting area of the first substrate and the cover window.

A two-in-one connector for both SIM card of mobile phone and memory card, comprises a terminal block, a plurality of first conductive terminals for connecting the SIM card inserted, a plurality of second conductive terminals for connecting the memory card inserted, a slot block, and a top cover, wherein the terminal block comprises a first terminal block and a second terminal block adjacent to the first terminal block; the first conductive terminals and the second conductive terminals are respectively installed in the first terminal block and the second terminal block; the slot block comprises a first base plate, a rear wall, a first side wall, a partition wall formed by extending downwards from an inner side of the first base plate, a second base plate extending from bottom of the partition wall, and a second side wall extending upwards from the second base plate; the first base plate is provided with a first opening corresponding to the contact portions of the first conductive terminals; the second base plate is provided with a second opening corresponding to the contact portions of the second conductive terminals; the top cover comprises a cover body covering on the slot block.

A structure improvement of orthopaedic implant includes a tibial baseplate, a tibial insert, and a reinforcement. The tibial baseplate forms a recess having a bottom that has a central portion defining a through hole extending through the tibial baseplate. The through hole has a top circumference that defines a circumferential groove extending outward. The tibial insert has a bottom forming a projection corresponding to the recess of the tibial baseplate for press-fitting to the tibial baseplate. A support is formed on at a central portion of a top of the tibial insert and defines a bore that extends through the tibial insert. The tibial insert forms two curved surfaces on opposite sides of the support to support contact and rolling. The reinforcement is inset in the tibial insert and includes a sleeve and a bolt.

A surface emitting laser device is disclosed that is able to selectively add a sufficiently large loss to a high order transverse mode so as to efficiently suppress a high order transverse mode oscillation and to oscillate at high output in a single fundamental transverse mode. The surface emitting laser device includes a first resonance region that includes an active layer and spacer layers, two distributed Bragg reflectors that sandwich the resonance region, and a current confinement structure that defines a current injection region for the active layer. At least one of the distributed Bragg reflectors includes a second resonance region arranged in the current injection region excluding a predetermined region surrounding a center of the current injection region.

The invention discloses a protecting, fixing and retracting integration device of an acoustic emission deep hole monitoring sensor. The device consists of a sensor protecting sleeve, a fixing device of the sensor protecting sleeve, a guider, a mounting rod, a directional ring and a rotary disc. The front end of the sensor protecting sleeve is connected with the fixing device of the sensor protecting sleeve by counterclockwise screws. The tail part of the sensor protecting sleeve is connected with the guider by clockwise screws, and is connected with the mounting rod through a pin and a unidirectional clamping groove. The directional ring is fixed at the front end of the mounting rod. The rotary disc is mounted on the tail part of the mounting rod. During retracting, the rotary disc facilitates the mounting rod to screw the sensor protecting sleeve off the fixing device of the sensor protecting sleeve. The device can better overcome the defects of insufficient protection, simple mounting angle and large absence or deflection of the monitored data due to untight coupling of the sensor and the rock existing in the traditional sensor, solves the problem of difficult retracting of the sensor in deep hole mounting, can be widely applied to rock engineering of tunnels, underground chambers, mine underground stopes, roadways and the like, and has great economical benefit.

A tongue retaining system is disclosed herein generally having, in one variation, a two-part system. A covering can be sized to fit at least partially over or upon a tongue of a patient, where the covering has an engagement mechanism positioned thereon. A retaining device, sized to fit within a mouth of the patient, may be positioned upon the teeth and have a corresponding engagement mechanism positioned thereon for temporarily coupling with the engagement mechanism on the covering. Such a system can be used to maintain or hold a natural position of the tongue within the mouth of the patient to maintain patency of the airway passages.

A recessed portion is formed in a predetermined position in a heat-spreading component. A thermoplastic resin serving as a thermal interface material (TIM) is stored in the recessed portion. Meanwhile, a large number of filamentous thermo-conductive elements serving as the TIM are arranged to stand side by side on a surface of the heat-spreading component in which the recessed portion is formed (or on an exposed surface of an electronic component). Then, the heat-spreading component is fixed onto a board in such a manner that the surface of the heat-spreading component in which the recessed portion is formed faces the board and that a clearance is adjusted between the electronic component and the heat-spreading component. Thereafter, the resin is heated to a softening point thereof into a fluidized state, and the resin is flowed and filled into the clearance between the electronic component and the heat-spreading component.

The present invention provides an optical semiconductor device including a semiconductor thin film (4) having photoconductivity and a pair of electrodes (5) and (10) for applying an electric field to an inside of the semiconductor thin film (4) in a direction approximately vertical to a surface of the semiconductor thin film (4), wherein the semiconductor thin film (4) generates an electromagnetic wave when light is applied to a region thereof to which the electric field is applied. The electrodes are provided to a front surface and a back surface of the semiconductor thin film (4) with the semiconductor thin film interposed therebetween.

Surgical navigation for revision surgery includes temporality coupling a reference arc to a surgical object that was substantially permanently affixed to a bone of a patient during a preceding surgery. The reference arc includes a navigation tracker configured to communicate with a navigation system. A surgical instrument is coupled to a respective navigation tracker that is also configured to communicate with the navigation system. A known relationship between the navigation tracker of the reference arc and the navigation tracker of the surgical instrument is used to determine a spatial characteristic of the surgical instrument, such as an position or orientation of the surgical instrument. The spatial characteristic is rendered upon a display unit.

An MR element includes a first exchange coupling shield layer, an MR stack, and a second exchange coupling shield layer that are arranged in this order from the bottom, and a nonmagnetic layer surrounding the MR stack. The MR stack includes a first free layer, a spacer layer, a second free layer, and a magnetic cap layer that are arranged in this order from the bottom. The magnetization direction of the first free layer is controlled by the first exchange coupling shield layer. The second free layer is magnetically coupled to the second exchange coupling shield layer via the magnetic cap layer for magnetization direction control. In the step of forming the MR stack and the nonmagnetic layer, a protection layer is formed on a layered film that will be the MR stack later, and a mask is then formed on the protection layer. Next, the layered film and the protection layer are etched using the mask and then the nonmagnetic layer is formed. After removal of the mask, the protection layer is removed by wet etching.

A battery pack includes a battery cell; an insulation holder coupled to the battery cell, the insulation holder having a fixing hole; and a protection circuit module coupled to the insulation holder, the protection circuit module having a fixing tab, wherein the fixing tab is fixed to the battery cell through the fixing hole.

A first housing includes a first conductor plate, and a second housing includes a second conductor plate. A rotation mechanism openably and closably attaches the second housing to the first housing. A first driven element and a second driven element are arranged along a rotation axis of the rotation mechanism. Between the first driven element and the second driven element, a continuity structure intersects the rotation axis to establish direct-current or high-frequency continuity between the first conductor plate and the second conductor plate. An antenna device can be provided which can ensure sufficient isolation between a plurality of driven elements.

An attachment coupler for heavy machinery, which detachably installs an attachment to an arm of the heavy machinery, includes a coupler body coupled to the arm of the heavy machinery, a fixed hook formed on the coupler body and coupled to the attachment via a first coupling pin, a movable hook rotatably coupled to the coupler body via a hinge axis and coupled to the attachment via a second coupling pin, a hydraulic cylinder that rotates the movable hook to be coupled to or disengaged from the second coupling pin, and a locking device that includes a locking hook and an engagement device. The locking hook is rotatably coupled to the coupler body via a hinge axis and closes an open end of the fixed hook while being coupled to the first coupling pin. The engagement device rotates in association with the rotation of the movable hook.

A smaller and higher performance optical transmitter module is provided, which can improve the reliability and which can be manufactured at lower costs and allow for stable laser transmission of an optical semiconductor element. The optical transmitter module which has an optical semiconductor element, an optical fiber optically coupled to the optical semiconductor element, an inline optical isolator provided for the optical fiber, and a package case containing the optical semiconductor element and the optical fiber, includes a substrate member with one end of the optical fiber on the light incident side fixed thereon to be optically coupled to the optical semiconductor element, a thermoelectric cooler with the substrate member joined to the top surface thereof, and a pipe-like support member projecting from the side face of the package case for fixing the optical isolator.

Disclosed is a soldering structure for mounting at least one connector on a flexible circuit board. The connector includes SMD pins and solder-dipping pins. The flexible circuit board has a connector mounting section having a component surface on which SMD soldering zones and solder-dipping pin holes are formed. A reinforcement plate is coupled to a reinforcement bonding surface of the flexible circuit board. The reinforcement plate has through holes corresponding to the solder-dipping pin holes of the flexible circuit board. The SMD pins of the connector are respectively soldered to the SMD soldering zones of the flexible circuit board, and the solder-dipping pins of the connector are respectively inserted through the solder-dipping pin holes of the flexible circuit board and the through holes of the reinforcement plate to the soldering surface of the reinforcement plate to be soldered with a solder material.

A headset with an adjustable microphone boom which can be adjusted to and from a position near the mouth of a user and is mounted in a housing by a friction part being coupled to a flexible friction coupling which is configured in a plate in that co-operating plates are stamped out of the plate and are connected to the plate by means of flexible arms. The friction part has a shaft which can be accommodated in a bearing defined by recesses which are configured partly in the inside of the housing and partly in the plate. The microphone boom, the housing and the plate with friction coupling are held together by means of a locking ring. In this way a stable, adjustable microphone boom is provided which does not become loose with time, understood in the way that no matter in which position and regardless of how frequently the position is changed, the microphone boom will remain secured with a sufficient force in the friction coupling.

A coupling nut for an electrical connector connectable to an electrical cable having an outer conductor surrounded by a jacket. The coupling nut formed as a cylindrical body with a bore extending between a cable end and a connector end. An annular wedge groove in the bore sidewall proximate the cable end with an angled wedge surface extending from the bore sidewall at a cable end side to a bottom diameter within the wedge groove. A snap ring retained in the wedge groove, an inner surface of the snap ring provided with a gripping feature.

There is provided a wire connection structure for laminated glass, which is capable of electrically connecting a conductor embedded in laminated glass and a lead wire without soldering, and laminated glass including such a wire connection structure.

A wire connection structure comprising an embedded electrode 8 embedded in laminated glass 1; a housing 2, 22 configured to form a space along with the laminated glass 1 and to have an insertion slot 13, 33 formed therein so as to communicate with the space, the housing being disposed on the laminated glass 1 so that the space confronts the embedded electrode 8; an elastic terminal 3, 23 received into the space of the housing 2, 22 and made of a conductive material; and a connector 5 connected to a lead wire 4; the terminal 3, 23 including a terminal strip 16, 36 to be detachably connected to the connector 5, and an external electrode 17, 37, the external electrode being configured to be electrostatic-capacitively coupled with the embedded electrode 8 when the terminal is received into the housing 2, 22 and is elastically deformed in the space to be pressed against the laminated glass.