The invention discloses a
radio frequency chip integrated packaging structure and technology, and the structure comprises the following steps: carrying out the primary packaging of a first line which is parallel and is uniformly arranged at intervals, and forming a first packaging layer; holes are drilled in the surface of the first encapsulation layer to
expose all end points of the first lines,
metal is electroplated on the exposed end points to fill the drilled holes, wiring connecting columns are electroplated on a set of
diagonal end points arranged on the two edge first lines, and first stand columns are electroplated on the other exposed end points;
electroplating a wiring layer on one surface of the encapsulation layer, and electrically rearranging the wiring connecting columns; the electrical end of the bare
chip is electrically connected and mounted with the corresponding wiring layer, and the bare
chip and the wiring layer are encapsulated again to form an encapsulation layer II; drilling holes in the surface of the encapsulation layer II to
expose the end points of the upright posts I, and
electroplating upright posts II on the exposed end points to fill the drilled holes; the bare chip is located in the geometric center of the three-dimensional coil, the induction current and the
signal intensity are optimal, the three-dimensional coil has the more omnidirectional induction characteristic, and stable
coupling can be kept.