The invention discloses a thyristor module, belonging to the field of manufacturing of power semiconductor modules. The thyristor module adopts a new way to connect a chip and a signal end, therefore, the process and the material are simplified, and the product has connecting structure which is high in reliability and consistency, thereby remarkably optimizing the performance of the product. The thyristor module comprises a bottom plate, a housing, a substrate, a chip I, a chip II, an electrode I, an electrode II, an electrode III, a signal terminal Ga, a signal terminal Ka, a signal terminal Kb and a signal terminal Gb; the front surfaces of the two chips are provided with positive electrodes A, and the back surfaces are provided with negative electrodes K and gates G; and a conductive block zone I, a conductive block zone II, a conductive block zone III, a conductive wire zone I, a conductive wire zone II, a conductive wire zone III and a conductive wire zone IV which are mutually insulated are printed on the top surface of the substrate. According to the thyristor module, the consistency of the product is greatly improved, and the reliability is enhanced as well. Therefore, the raw materials and the process steps of the product are greatly simplified, the manufacturing yield is improved, the performance and the consistency are remarkably enhanced, and the reliability is improved.