The invention relates to the technical field of
integrated circuit board finished product detection, in particular to a computing
processing module finished product monitoring method and
system, and the method comprises the steps: scanning a plurality of computing
processing module finished products passing through a finished product conveying belt in real time through a
linear array laser scanner disposed above the finished product conveying belt, and carrying out the real-time monitoring of the plurality of computing
processing module finished products; further obtaining a spectrum pattern corresponding to each calculation processing module finished product; identifying
local spectrum patterns corresponding to the plurality of
chip assemblies in the spectrum pattern; and sequentially detecting whether each
local spectrum pattern has a plane flaw, if so, evaluating the damaged surface of the plane flaw, and evaluating the damage degree of the damaged
chip assembly based on the proportion of the damaged surface. According to the monitoring method, the
spectral pattern representing the height information is generated in real time through the
linear array laser scanner, the local areas of the multiple
chip assemblies are accurately recognized in combination with the RGB color threshold value and the image
feature extraction algorithm, interference caused by dense arrangement of the multiple assemblies is effectively avoided, and the positioning precision and the anti-
noise capacity of plane defect detection are improved.