The application relates to the technical field of
semiconductor manufacturing, and discloses a
wafer defect detection method, a
wafer defect detection device and a medium. The method comprises the following steps: performing
image processing on a target
wafer image of a wafer object to be detected to obtain a plurality of
local spectrum regions; performing complex filtering
processing on the
local spectrum regions in a plurality of scales and a plurality of directions to obtain response information of each
local spectrum region under different scales and different directions; determining a phase consistency residual graph, a
frequency band leakage residual graph and a direction offset residual
graph based on phase responses and energy responses in the response information, a pre-constructed spectrum phase
reference field, a main
frequency band and a main direction; performing multi-scale residual
back projection processing on the target wafer image to obtain a multi-scale residual
back projection graph; generating a defect saliency
graph based on any one or several of the phase consistency residual graph, the
frequency band leakage residual graph, the direction offset residual graph and the multi-scale residual
back projection graph; and performing defect detection based on the defect saliency graph to obtain a target detection result.