In a method for producing a microstructured component which has a substrate (140) and at least one microstructured functional layer
system (130) applied to the substrate, a workpiece is provided which has the substrate, a functional layer
system applied to the substrate, and a cover layer
system (110) applied to the functional layer system.
Laser radiation is radiated through the cover layer system from a side facing away from the substrate onto a buffer layer (112), adjoining the cover layer, of the functional layer system in such a way that the
laser radiation weakens or destroys a connection between the buffer layer and the cover layer system within at least one locally delimited target area in a
boundary region between the buffer layer and the cover layer system. As a result, material of the cover layer system (110) is removed in the target area in order to
expose the buffer layer (112) in the target area. The
boundary region is irradiated by means of direct
laser interference patterning (DLIP) by virtue of a
laser beam emitted by a primary laser
radiation source being split into at least two partial beams (TS1, TS2) and the partial beams being guided such that at least two mutually coherent partial beams pass through the cover layer system and a spatial intensity pattern is produced in a
superimposition region (IVOL) of the coherent
laser beams, said spatial intensity pattern having radiation microzones (MZ) with constructive interference and relatively high laser
radiation power density adjacent to regions of destructive interference and low laser
radiation power density in relation to the radiation microzones, wherein damaged microzones arranged with lateral spacings are produced in the
boundary region by the laser radiation in the radiation microzones.