4results about How to "Reduce outside distractions" patented technology

The embodiment of the present application discloses an XY coupling table, which comprises a bottom plate, a top plate, an X-axis driving mechanism and a Y-axis driving mechanism, the X-axis driving mechanism comprises an XY-axis guide rail assembly, an X-axis mover and an X-axis coil, the Y-axis driving mechanism comprises a YX-axis guide rail assembly, a Y-axis mover and a Y-axis coil, the XY-axis guide rail assembly comprises a first X-axis guide rail assembly and a first Y-axis guide rail assembly, the X-axis mover of the X-axis driving mechanism is connected with the first X-axis guide rail assembly; the YX-axis guide rail assembly comprises a second Y-axis guide rail assembly and a second X-axis guide rail assembly, the Y-axis mover of the Y-axis driving mechanism is connected with the second Y-axis guide rail assembly; and the top plate is connected with the first Y-axis guide rail assembly and the second X-axis guide rail assembly. The present application can significantly reduce the assembly height and the overall volume of the coupling table, remove the drag chain cable, reduce the motion friction and external interference, and greatly improve the alignment accuracy and the fiber coupling efficiency of the coupling table.

The utility model relates to ultraviolet moth luring and killing device technical field, and disclose a kind of ultraviolet moth luring and killing device for unmanned aerial vehicle, including unmanned aerial vehicle body, the bottom of unmanned aerial vehicle body is fixedly connected with top surface installation fixed plate, the bottom of top surface installation fixed plate is provided with contraction lifting assembly, the bottom of contraction lifting assembly is fixedly connected with transparent trapping support frame, the inside of transparent trapping support frame is provided with ultraviolet moth luring component, the inside of transparent trapping support frame is provided with pest killing component, the both sides of transparent trapping support frame are provided with side surface rotary sealing assembly, the utility model has obvious advantages, contraction lifting assembly height is adjusted flexibly, accurately approach pest area, improve moth luring efficiency, built-in sticky insect catching plate and internal insecticidal high-voltage power grid cooperate, multiple killing ensure that pest is difficult to escape, side surface rotary sealing assembly is intelligently regulated, in combination with ultraviolet wavelength adjustment, so that device can adapt to different pest scene.

The invention provides transcranial electrical stimulation equipment, and particularly relates to the technical field of brain-computer interfaces, and the equipment comprises an electrical stimulation electrode array which is used for carrying out transcranial electrical stimulation and electroencephalogram signal collection on a target stimulation object; the electrical stimulation electrode array comprises a plurality of electrodes, and each electrode is provided with an electrode contact; each electrode contact is covered with an interface modification layer, the interface modification layer comprises a first hydrogel layer and a second hydrogel layer which are stacked in sequence, the first hydrogel layer is attached to the electrode contact, and the second hydrogel layer is used for making contact with the target stimulation object; the modulus of the first hydrogel layer is higher than that of the second hydrogel layer; the electrical stimulation control element is connected with the electrical stimulation electrode array and used for controlling current output of the electrical stimulation electrode array according to the electroencephalogram signals collected by the electrical stimulation electrode array. The quality and reliability of the electroencephalogram signals are improved.

This invention relates to a flip-chip structure and underfill packaging method for miniaturized crystal oscillators. The structure includes a packaging substrate, a quartz crystal resonator, an oscillating IC chip, and a sealing cap. Both the resonator and the IC chip are flip-chip bonded to the substrate via conductive bumps, with the resonator bumps being higher than the IC chip bumps, forming a vibration gap. A low-modulus underfill adhesive layer is filled into the gap between the chip and the substrate to buffer stress and redistribute thermomechanical stress, ensuring the stability of the resonant frequency. The packaging method includes solder placement, chip mounting, reflow soldering, underfill adhesive injection and curing, and hermetically sealed packaging steps. This invention effectively suppresses frequency drift caused by temperature stress through the synergistic effect of the vibration gap design and the low-modulus adhesive layer, while achieving high integration, low electromagnetic interference, and high reliability in miniaturized crystal oscillator packaging through a fully flip-chip and sealed structure.