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3results about How to "Simplify the determination process" patented technology

Strike-slip displacement amount determination method, device, equipment, medium and computer program

PendingCN122110226ASimplify the determination processGuaranteed accuracy
This disclosure relates to the field of geological structure assessment technology, and particularly to a method, apparatus, equipment, medium, and computer program for determining strike-slip displacement. The method includes performing the following determination process on both the first and second strata located on both sides of the target fault plane: determining the uplift area and depth of the strata corresponding to the gypsum-salt development area; determining the strata shortening based on the uplift area and depth; and determining the strike-slip displacement of the target fault plane based on the strata shortening corresponding to the first and second strata. For the first and second strata, the uplift area and depth of the strata corresponding to the gypsum-salt development area are used as the basis for determining the strata shortening. Utilizing gypsum-salt rheological theory, the kinematic characteristics of the gypsum-salt development area are extracted and the strata shortening is determined according to their established correspondence, thereby simplifying the strike-slip displacement determination process and ensuring the accuracy of the strike-slip displacement determination results.
Owner:CHINA PETROLEUM & CHEMICAL CORP +1

A method for determining the upper water saturation value of a tight gas reservoir using two-phase permeability

This invention discloses a method for determining the upper limit of water saturation in tight gas reservoirs using two-phase permeability analysis, comprising: 1. Selecting several rock samples for gas-water two-phase permeability analysis, and establishing a gas-water phase permeability curve based on the relative permeability of the water phase, the relative permeability of the gas phase, and the water saturation value of each rock sample; 2. Based on the gas-water phase permeability curve, first reading the water saturation value of each rock sample when the relative permeability of the water phase is a set value A, then reading the relative permeability of the gas phase corresponding to the same water saturation value of each rock sample, and determining the upper limit of water saturation for each rock sample accordingly; 3. Calculating the average value of the upper limit of water saturation for each rock sample, and the obtained average value is the upper limit of water saturation for the tight gas reservoir. This invention can accurately determine the upper limit of water saturation in tight gas reservoirs using relatively simple means, simplifying the determination process and improving accuracy compared to existing technologies, providing an accurate basis for the rational exploitation of tight gas reservoirs.
Owner:PETROCHINA CO LTD

A vision-based wafer edge location method, apparatus, and readable medium

ActiveCN121772677BSimplify edge finding and positioning processImprove positioning efficiencyImage analysisEdge mapsVision based
This invention relates to the field of semiconductor manufacturing and testing technology, specifically to a vision-based wafer edge-finding and positioning method, apparatus, and readable medium. The method includes the following steps: acquiring edge images of the wafer to be positioned using an image acquisition device; constructing a mechanical coordinate system based on the wafer in a standard position; performing edge point search and notch matching search on all edge images to determine the center of the circle to be positioned and the center of the notch to be positioned; unifying the coordinates of the center of the circle to be positioned and the center of the notch to be positioned and transforming them to the mechanical coordinate system; calculating the rotation angle based on the mechanical coordinates of the center of the circle to be positioned and the center of the notch to be positioned; and then controlling a rotation and translation platform to perform rotation and translation operations on the wafer to be positioned based on the center of the circle to be positioned and the rotation angle to adjust the wafer to be positioned to the standard position. The method proposed in this application solves the problems of multiple positioning and poor accuracy in the prior art by acquiring edge images and adjusting positioning in one step.
Owner:INST OF IND DESIGN & MASCH INTELLIGENCE INNOVATION HUNAN UNIV QUANZHOU +1