The invention relates to a manufacturing method of an
integrated circuit partition
control power supply embedded
copper block circuit board, which comprises the following steps of: forming an integrated
copper block constructed by bottom
copper and a special-shaped copper block through one-time depth control milling in the previous procedure, and manufacturing a windowing core plate and carrying out primary embedding forming on the windowing core plate and the integrated copper block; the problems of deformation and liquid
medicine permeation caused by thickness difference are avoided through the thickness balance effect of a first single-face windowing copper-clad plate and a second single-face windowing copper-clad plate and the isolation protection function of a first windowing release film and a second windowing release film in the second multi-layer structure stacking and laminating
processing in the middle procedure; and finally, an auxiliary structure is precisely removed through
laser depth-controlled milling, the position precision of the irregular special-shaped copper block is guaranteed in the whole process, the problems of deflection, deviation and the like are thoroughly avoided, the functions of the special-shaped copper block in various and multiple
integrated circuit partition packaging control application, efficient heat dissipation, large current bearing, high-
voltage adaptation and the like can be fully played, and the production efficiency is improved. And high-precision
processing and application of the partition control high-heat-dissipation circuit board are realized.