The invention provides a
model correction method supporting large-scale
parallel computing, which relates to the technical field of
semiconductor manufacturing, and can accurately correct a model according to the distribution characteristics of input data and the variation trend of errors in an
iteration process by dynamically adjusting physical constraints according to data distribution characteristics and
error feedback in a correction process. The constraint condition of a
physical model is optimized in real time, the precision and adaptability of the model are remarkably improved, a local optimal solution can be effectively avoided, and it is ensured that an output result better conforms to the
physical law, so that higher prediction reliability is achieved in
semiconductor manufacturing, meanwhile, the number of iterations caused by improper initial parameters is reduced, the calculation efficiency is optimized, and the reliability is improved. According to the method, collaborative optimization of global and local correction is achieved in
parallel computing supporting tens of thousands of CPUs, the computing speed and the
resource utilization rate are greatly increased, the robustness and expandability of the method are enhanced, the method can seamlessly process the data scale from the GB level to the TB level, and the method is suitable for industrial environments with different hardware configurations.