The invention relates to a resistive layer self-gating resistive random access memory as well as a building method and application thereof. The resistive random access memory comprises an overlappinglayer, wherein the overlapping layer comprises a fourth Hf layer, a fourth Si<3>N<4> layer, a third Hf layer, a third Si<3>N<4> layer, a second Hf layer, a second Si<3>N<4> layer, a first Hf layer anda first Si<3>N<4> layer which are arranged in sequence from outside to inside. During 1R array gating based on a homogeneous HfO<x> base, a resistive layer is taken as a gating layer, so that an extra third gating device is prevented from being introduced. An asymmetrical structure is machined based on micro-nano for filling (or hollowing), a depletion region is formed on the periphery of a filling region under the micro-nano scale, and the depletion region dynamically changes along with an external electric field. A self-gating effect is achieved according to the universal physical principle. Thus, the resistive random access memory is not limited to the HfO<x> material, but also suitable for all materials capable of forming the depletion region.