This invention discloses a horizontally structured nano-
air channel transistor based on multilayer thin films, belonging to the field of
transistor technology. It includes an insulating substrate, a multilayer thin film
cathode and
anode disposed on its front side, with a nano-
air channel formed between the
cathode and
anode. The multilayer thin film
cathode is composed of alternating
layers of conductive and insulating thin films. The
anode is composed of a conductive material, or is composed of alternating
layers of conductive and insulating thin films. Conductive sidewalls are also provided on one side of the multilayer thin film cathode and anode for
electrical connection between the conductive thin film
layers. This invention achieves a large field enhancement factor through the sharp
edge structure of the multilayer thin films and effectively increases the
field emission current of the
transistor by utilizing the tandem emission of the multilayer thin films. Simultaneously, because vertical
etching or
corrosion processes can easily achieve 90-degree sidewalls, the isomorphism of the emission structure of each layer in the multilayer thin film is maintained, enabling simultaneous
electron emission from the multilayer thin films in series to maintain a stable emission current.