The application discloses a
heat pump air conditioning system, comprising a driving module, the driving module comprising a
driving circuit and a heat-conducting substrate, wherein the
driving circuit is used for driving a motor in the
heat pump air conditioning system, and the heat-conducting substrate is used for conducting and dissipating heat generated by the
driving circuit to the surrounding environment; further comprising a heating module and a heat dissipation module, wherein the heating module is arranged close to the heat-conducting substrate or in the heat-conducting substrate; when the heating module is in a heating state, the heating module is used for raising the temperature of the heat-conducting substrate, and the heat dissipation module is arranged close to the heating module, and the heat dissipation module comprises a heat dissipation pipeline, and the heat dissipation pipeline is used for guiding
refrigerant flow to dissipate heat for the driving module. The
heat pump air conditioning system provided by the application forms a reasonable
heat transfer path by arranging the heat dissipation module close to the heating module and arranging the heating module close to the heat-conducting substrate; on one hand, the heating module does not affect normal heat dissipation, and on the other hand, the heating module can be used for raising the temperature of the heat-conducting substrate to inhibit condensation of the driving module, and the
heating power can be greatly reduced.