The invention provides a gold-plated bonding aluminum wire and a preparation method thereof. The gold-plated bonding aluminum wire comprises the following components in percentage by
mass: 15%-20% ofcopper, 0.3%-5% of
nickel or 0.3%-6.5% of silver, 1.2%-7.5% of gold and the balance of aluminum or aluminum-
silicon alloy. The preparation method comprises the steps of preparing an aluminum rod or analuminum-
silicon alloy rod,
coating copper, performing drawing, performing
nickel plating or silver plating, performing
gold plating, and finally performing fine drawing, ultra-fine drawing and heattreatment to prepare the gold-plated bonding aluminum wire. The gold-plated bonding aluminum wire has the characteristics of high strength and high reliability, application of an IGBT device is met, large-length drawing of the gold-plated bonding aluminum wire is achieved by adopting small
area reduction rate
machining and controlling the angle of an inlet area, the length of a
sizing area and theangle of an outlet area of a die, and the phenomenon that the gold-plated bonding aluminum wire is prone to breakage in the
wire drawing process is eliminated; and meanwhile, the surface of the gold-plated bonding aluminum wire is ensured to have good smoothness, and the
bonding strength in the
bonding process is effectively ensured.