52results about How to "Required property" patented technology

A method for fabricating turbine engine blade or vane made of composite material includes: performing three-dimensional weaving to make a single-piece fiber blank; shaping the fiber blank to obtain a single-piece fiber preform having a first portion forming a preform for at least a blade / vane airfoil, at least one second portion forming a preform for an inner part of a blade / vane inner platform or for an outer part of a blade / vane outer platform, and at least one third portion forming a preform for an outer part of a blade / vane inner platform or for an inner part of a blade / vane outer platform; and densifying the fiber preform with a matrix to obtain a composite material blade, and forming a single piece with an inner and / or outer platform(s) incorporated therein.

A turbine engine blade made of composite material including fiber reinforcement densified by a matrix is fabricated by a method including: performing three-dimensional weaving to make a single-piece fiber blank; shaping the fiber blank to obtain a single-piece fiber preform having a first portion forming a preform for a blade root and an airfoil, at least one second portion forming a preform for a blade inner platform or for wipers of a blade outer platform, and at least one third portion forming a preform for reinforcing a blade inner platform or for overhangs of a blade outer platform; and densifying the fiber preform with a matrix to obtain a composite material blade having fiber reinforcement constituted by the preform and densified by the matrix, and forming a single piece with an inner and / or outer platform incorporated therein.

An adhesive film for semiconductor use of the present invention is used in a method in which, after the adhesive film for semiconductor use is laminated to one side of a metal sheet, the metal sheet is processed to give a wiring circuit, a semiconductor die is mounted and molded, and the adhesive film is then peeled off. The adhesive film includes a resin layer A formed on one side or both sides of a support film, the 90 degree peel strength between the resin layer A and the metal sheet prior to the processing of the metal sheet laminated with the adhesive film for semiconductor use to give the wiring circuit is 20 N / m or greater at 25° C., and the 90 degree peel strengths, after molding with a molding compound the wiring circuit laminated with the adhesive film for semiconductor use, between the resin layer A and the wiring circuit and between the resin layer A and the molding compound are both 1000 N / m or less at at least one point in the temperature range of 0° C. to 250° C.

A textile thread having a core and a sheath surrounding the core. The core, formed of high-tenacity synthetic organic endless fibers, is tightly wound by slit film tapes made of polytetrafluoroethylene (PTFE) in the S-direction and the Z-direction, or vice versa, and the slit film tapes forms a sheath.

Embodiments of the invention provide a perpendicular magnetic recording medium having a granular structured magnetic recording layer including many columnar grains, and grain boundary layers containing oxide, wherein a high medium S / N ratio is obtained while securing head flyability and durability. In an embodiment, the perpendicular magnetic recording medium includes a granular structured magnetic recording layer having many columnar grains, as well as grain boundary layers including oxide respectively. Assuming that the columnar grains are divided equally in the film thickness direction into a protective layer side portion and an intermediate layer side portion, and the diameter of the protective layer side portion is larger than that of the intermediate layer side portion.

An organic light emitting diode (“OLED”) display includes a substrate, a gate line, a data line, a driving voltage line, a light blocking member, a switching thin film transistor (“TFT”), a driving TFT, and an OLED, wherein the driving voltage line includes a portion parallel to at least one of the gate line and the data line, the light blocking member is formed under at least one of the gate line, the data line, and the driving voltage line, the switching TFT is connected to the gate line and the data line and includes an amorphous semiconductor, the driving TFT is connected to the switching TFT and includes a polycrystalline semiconductor, and the OLED is connected to the driving TFT.

The present disclosure describes a replacement for petroleum jelly as a base for products which is suitable for most any application for which petroleum jelly can be used. The jelly is a glycerine based jelly composition comprising; vegetable derived glycerine and an emulsifier, wherein the emulsifier can be any known and / or commercially available glucoside containing emulsifier. Other suitable emulsifiers together with glycerine and essential or vegetable based oils with or without inorganic fillers may also be added to the jelly to impart fragrance, color, UVA and UVB sun protection factor(s), immuno-enhancing aromatherapeutics, as well as free radical scavenging constituents. In addition, temperature stabilizers and stiffening agents such as waxes and other inorganic fillers including silica and clays may also be added during manufacture as required. The glycerine is preferably present in the range of 50-95%. Other ingredients which may be added include vitamins and provitamins, carotenoids, as well as aloe vera gel or juice.

A holding sealing material includes a mat, an inorganic binder and an organic binder. The mat includes inorganic fibers and has an upper part, a center part, and a lower part in a thickness direction. The inorganic binder is loaded on the mat. The organic binder is loaded mainly on the upper part and the lower part of the mat. The holding sealing material is disposed between an exhaust gas-treating body and a casing for housing the exhaust gas-treating body to form an exhaust gas purifying apparatus.

The purpose of the present invention is to provide: a resin composition, a cured product of which has extremely low residual stress and exhibits excellent adhesion to a metal substrate such as a Pt, LT or Ta substrate after a wet heat test in the fields of semiconductors and MEMS / micromachine applications; a laminate of this resin composition; and a cured product of this resin composition or the laminate. The present invention is a photosensitive resin composition which contains an epoxy resin (A), a compound having a phenolic hydroxyl group (B) and a cationic photopolymerization initiator (C), and wherein: the epoxy resin (A) has a weighted average epoxy equivalent weight of 300 g / eq. or more; 20% by mass or more of the epoxy resin (A) is an epoxy resin represented by formula (1) and having an epoxy equivalent weight of 500-4,500 g / eq.; and the compound having a phenolic hydroxyl group (B) contains a phenolic compound having a specific structure.