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This application discloses a die bonding method, equipment, and process product, relating to the field of semiconductor processing technology. The die bonding method includes transporting a conveyor belt to transport any row of initial labels on the belt to a dispensing station; the conveyor belt array has multiple rows and columns of initial labels; a dispensing module is moved to the dispensing station along a first direction, and the dispensing module is used to position, identify, and dispense each row of initial labels, and to perform dispensing quality inspection; the first direction is parallel to the arrangement direction of each row of initial labels; the conveyor belt is stepped with a preset row spacing to transport the next row of initial labels to the dispensing station, and dispensing is performed on multiple rows and columns of initial labels sequentially; the dispensed labels on the conveyor belt are sequentially subjected to chip bonding, pressing, and curing to obtain finished chip labels. This application replaces the movement of a large inertia platform with a lightweight movement method of the dispensing module, achieving a balance between cost and control accuracy.