48 results about "Process variability" patented technology

In one aspect, a method of enhancing semiconductor chip process variability and lifetime reliability through a three-dimensional (3D) integration applied to electronic packaging is disclosed. Also provided is an arrangement for implementing the inventive method. In another aspect, a method and on-chip controller are disclosed for enhancing semiconductor chip process variability and lifetime reliability through a three-dimensional (3D) integration applied to electronic packaging. Also provided is an on-chip reliability / variability controller arrangement for implementing the inventive method. In yet another aspect, base semiconductor chips, each comprising a plurality of chiplets, are manufactured and tested. For a base semiconductor chip having at least one non-functional chiplet, at least one repair semiconductor chiplet chiplet is vertically stacked. A functional multi-chip assembly is formed, which provides the same functionality as a base semiconductor chip in which all chiplets are functional.

A system and method are provided for a PTAT cell with no resistors which can operate at low power, has less sensitivity to process variation, occupies less silicon area, and has low noise. Further, a system and method are provided to scale up the reference voltage and current through a cascade of unit cells. Still further, a system and method are provided for PTAT component to be fine-tuned, advantageously providing less process variability and less temperature sensitivity.

Embodiments include a method comprising depositing a hard mask layer over a first layer, the hard mask layer including; lower hard mask layer, hard mask stop layer, and upper hard mask. The hard mask layer and the first layer are patterned and a spacer deposited on the patterned sidewall. The upper hard mask layer and top portion of the spacer are removed by selective etching with respect to the hard mask stop layer, the remaining spacer material extending to a first predetermined position on the sidewall. The hard mask stop layer is removed by selective etching with respect to the lower hard mask layer and spacer. The first hard mask layer and top portion of the spacer are removed by selectively etching the lower hard mask layer and the spacer with respect to the first layer, the remaining spacer material extending to a second predetermined position on the sidewall.

A method for addressing process variability in a build-to-order, mass customization production environment. The method includes receiving an order for a product having a particular configuration defined by the order, initiating a production order specifically assigned to the order, fabricating the product based upon the production order, determining if an unrelated product order contains an identical product item configuration and automatically swapping identical product items contained on unrelated production orders to optimize overall production process objectives.

An improved automatic feedback control scheme enhances plasma spraying of powdered material through reduction of process variability and providing better ability to engineer coating structure. The present inventors discovered that controlling centroid position of the spatial distribution along with other output parameters, such as particle temperature, particle velocity, and molten mass flux rate, vastly increases control over the sprayed coating structure, including vertical and horizontal cracks, voids, and porosity. It also allows improved control over graded layers or compositionally varying layers of material, reduces variations, including variation in coating thickness, and allows increasing deposition rate. Various measurement and system control schemes are provided.

In sophisticated semiconductor devices, a strain-inducing semiconductor alloy may be positioned close to the channel region by forming cavities on the basis of a wet chemical etch process, which may have an anisotropic etch behavior with respect to different crystallographic orientations. In one embodiment, TMAH may be used which exhibits, in addition to the anisotropic etch behavior, a high etch selectivity with respect to silicon dioxide, thereby enabling extremely thin etch stop layers which additionally provide the possibility of further reducing the offset from the channel region while not unduly contributing to overall process variability.

Processing test results from a plurality of individual semiconductor testers by analyzing each test result at an adaptive test engine. A centralized system jointly analyzes all the test results from the plurality of individual semiconductor testers. The adaptive test engine or the centralized system identifies, based on the analysis of each test result or the joint analysis of all the test results, one or more of: a test environmental issue, a tester variability issue, a tester calibration issue, a product variability issue, and a manufacturing process variability issue. The adaptive test engine or the centralized system determines whether one or more of the plurality of individual semiconductor testers causes one or more of the identified issues or whether semiconductor products tested by the plurality of individual semiconductor testers causes one or more of the identified issues.

A transistor structure having an epitaxial layer deposited over an implanted substrate in order to reduce process variability. The epitaxial layer is able to be deposited doped, un-doped or lightly doped via up-diffusion from the implanted substrate, and used to form the channel for the transistor structure. As a result, this use of un-doped epitaxial layer provides the benefit of reducing process variability (e.g. random dopant fluctuation) and thus the transistor performance variability despite the small physical size of the transistors.

Embodiments of the invention provide to apparatuses and media used in drug elution studies and methods for making and using them. One embodiment of the invention is a drug elution method that can be used for in-vitro studies of a matrix impregnated with a compound such as a drug blended polymer matrix. Such methods and materials can be used for example to assess and control the manufacturing process variability of drug eluting implantable devices such as cardiac leads.

Embodiments of the invention provide to apparatuses and media used in drug elution studies and methods for making and using them. One embodiment of the invention is a drug elution method that can be used for in-vitro studies of a matrix impregnated with a compound such as a drug blended polymer matrix. Such methods and materials can be used for example to assess and control the manufacturing process variability of drug eluting implantable devices such as cardiac leads.