1 results about "Urea Peroxide" patented technology

This invention provides an acidic chemical mechanical polishing slurry for gallium arsenide substrates and its application, belonging to the field of chemical mechanical polishing technology. The polishing slurry comprises, by weight percentage, 0.5–5 wt% modified cerium oxide abrasive, 0.1–3 wt% peracetic acid, 0.05–2 wt% urea peroxide, and the balance deionized water, with a pH value of 3.0–5.0; wherein the modified cerium oxide abrasive is nano-cerium oxide particles with surface-grafted organic acid functional groups, with an average particle size of 20–80 nm. The acidic chemical mechanical polishing slurry for fine polishing of gallium arsenide substrates provided by this invention, by employing a dual oxidant system composed of peracetic acid and urea peroxide, combined with modified cerium oxide abrasive with surface-grafted organic acid functional groups, balances surface reaction stability, abrasive dispersibility, and low-load mechanical removal requirements under acidic conditions, thereby helping to reduce surface scratches, particle residue, and subsurface damage depth, and improving the surface integrity of gallium arsenide substrates after fine polishing.