33results about "Crystal growth process" patented technology

A process and system are provided for processing at least one section of each of a plurality of semiconductor film samples. In these process and system, the irradiation beam source is controlled to emit successive irradiation beam pulses at a predetermined predetermined repetition rate. Using such emitted beam pulses, at least one section of one of the semiconductor film samples is irradiated using a first sequential lateral solidification (“SLS”) technique and / or a first uniform small grained material (“UGS”) techniques to process the such sections) of the first sample. Upon the completion of the processing of this section of the first sample, the beam pulses are redirected to impinge at least one section of a second sample of the semiconductor film samples. Then, using the redirected beam pulses, such sections) of the second sample are irradiated using a second SLS technique and / or a second UGS technique to process the at least one section of the second sample. The first and second techniques can be different from one another or substantially the same.

A technique for forming a film of material (12) from a donor substrate (10). The technique has a step of introducing energetic particles (22) through a surface of a donor substrate (10) to a selected depth (20) underneath the surface, where the particles have a relatively high concentration to define a donor substrate material (12) above the selected depth. An energy source is directed to a selected region of the donor substrate to initiate a controlled cleaving action of the substrate (10) at the selected depth (20), whereupon the cleaving action provides an expanding cleave front to free the donor material from a remaining portion of the donor substrate.

The present invention provides a metal cluster-carrying metal oxide support wherein a metal cluster obtained by use of a dendrimer is prevented from migrating to the surface of support and being sintered, and a process for production thereof. The process for producing the metal cluster-carrying metal oxide support of the present invention comprises (a) coordinating a first metal ion to a dendrimer 10, (b) reducing the first metal ion coordinated to the dendrimer to precipitate a cluster 6a of the first metal in the dendrimer, (c) further coordinating a second metal ion 8 to the dendrimer, and (d) drying and firing the solution containing this dendrimer on a metal oxide support 9, wherein the oxide of the second metal is the same as the metal oxide constituting the metal oxide support, or a metal oxide capable of forming a composite oxide with the metal oxide constituting the metal oxide support. In the metal cluster-carrying metal oxide support of the present invention, the cluster 6a of the first metal is held by the oxide of the second metal 8 on the metal oxide support 9.

A warm-rolled, annealed, polycrystalline, cube-textured, {100}<100>, FCC-based alloy substrate is characterized by a yield strength greater than 200 MPa and a biaxial texture characterized by a FWHM of less than 15° in all directions.

A laser processing process which comprises laser annealing a silicon film 2 μm or less in thickness by irradiating a laser beam 400 nm or less in wavelength and being operated in pulsed mode with a pulse width of 50 nsec or more, and preferably, 100 nsec or more. A laser processing apparatus which comprises a laser generation device and a stage for mounting thereon a sample provided separately from said devices to thereby prevent transfer of vibration attributed to the movement of the stage to the laser generation device and the optical system. A stable laser beam can be obtained to thereby improve productivity.

It is often the case that a substrate suitable for epitaxial growth does not match a substrate desirable for the use in functional elements such as thermoelectric conversion elements or the like. The present invention makes it possible to separate a predetermined layered structure formed on a substrate therefrom through an action of water vapor. A method of manufacturing a crystalline film of the present invention includes the steps of: epitaxially growing on a substrate a crystalline film including a layered structure so that the layered structure comes into contact with the substrate; contacting water vapor supplied from a water vapor source with the layered structure in a chamber; and separating the layered structure that has been contacted with the water vapor from the substrate to obtain the crystalline film. The layered structure has a layer containing an alkali metal, and a layer containing an oxide of at least one element selected from the group consisting of Co, Fe, Ni, Mn, Ti, Cr, V, Nb, and Mo.

Disclosed herein is a semiconductor device manufacturing method for performing an annealing process of irradiating a semiconductor film on which element forming areas including thin film transistor forming areas are arranged in a two-dimensional pattern with energy beams using a plurality of irradiating optical systems, wherein in the annealing process, an area irradiated with the energy beams is divided into a single beam irradiated area irradiated by each of the plurality of irradiating optical systems with an energy beam singly and a boundary area situated between single beam irradiated areas adjacent to each other and irradiated by both of two irradiating optical systems performing beam irradiation of the single beam irradiated areas with energy beams.

A method for forming a semiconductor device is disclosed. The method comprises the step of irradiating a laser light to a surface of a semiconductor through a mask provided on said surface in an atmosphere comprising an impurity of one conductivity type to diffuse said impurity into a region of said semiconductor.

A method for forming a multi-material thin film includes providing a multi-material donor substrate comprising single crystal silicon and an overlying film comprising GaN. Energetic particles are introduced through a surface of the multi-material donor substrate to a selected depth within the single crystal silicon. The method includes providing energy to a selected region of the donor substrate to initiate a controlled cleaving action in the donor substrate. Then, a cleaving action is made using a propagating cleave front to free a multi-material film from a remaining portion of the donor substrate, the multi-material film comprising single crystal silicon and the overlying film.

An optical waveguide capable of having various characteristics and a method of manufacture thereof as well as a method of manufacturing a crystal film are provided. An optical functional material KTaxNb1-xO3 is used as an optical waveguide. The input optical signal is transmitted to the KTaxNb1-xO3 film. The KTaxNb1-xO3 film undergoes changes in optical property when an external voltage signal is applied to the electrode. Therefore, as it passes through the KTaxNb1-xO3 film, the input optical signal is modulated by the characteristic change. The modulated optical signal is taken out as an output optical signal.

The present invention provides a metal cluster-carrying metal oxide support wherein a metal cluster obtained by use of a dendrimer is prevented from migrating to the surface of support and being sintered, and a process for production thereof. The process for producing the metal cluster-carrying metal oxide support of the present invention comprises (a) coordinating a first metal ion to a dendrimer 10, (b) reducing the first metal ion coordinated to the dendrimer to precipitate a cluster 6a of the first metal in the dendrimer, (c) further coordinating a second metal ion 8 to the dendrimer, and (d) drying and firing the solution containing this dendrimer on a metal oxide support 9, wherein the oxide of the second metal is the same as the metal oxide constituting the metal oxide support, or a metal oxide capable of forming a composite oxide with the metal oxide constituting the metal oxide support. In the metal cluster-carrying metal oxide support of the present invention, the cluster 6a of the first metal is held by the oxide of the second metal 8 on the metal oxide support 9.

An embodiment of the invention provides a single crystal cleaved from a larger crystal and having a cleavage surface that extends along a natural crystallographic plane of the single crystal, the cleavage surface produced by generating a stress field to propagate a crack in the larger crystal along the natural plane, so that during cracking by the stress field a magnitude of a derivative of an energy release rate, G(α), generated by the stress field at a front of the crack as a function of angular deviation, α, from the natural plane, is less than or equal to twice an effective step energy, βe, divided by a step height, h.

It is an object to provide a laser apparatus, a laser irradiating method and a manufacturing method of a semiconductor device that can perform uniform a process with a laser beam to an object uniformly. The present invention provides a laser apparatus comprising an optical system for sampling a part of a laser beam emitted from an oscillator, a sensor for generating an electric signal including fluctuation in energy of the laser beam as a data from the part of the laser beam, a means for performing signal processing to the electrical signal to grasp a state of the fluctuation in energy of the laser beam, and controlling a relative speed of an beam spot of the laser beam to an object in order to change in phase with the fluctuation in energy of the laser beam.

An optical waveguide capable of having various characteristics and a method of manufacture thereof as well as a method of manufacturing a crystal film are provided. An optical functional material KTaxNb1-xO3 is used as an optical waveguide. The input optical signal is transmitted to the KTaxNb1-xO3 film. The KTaxNb1-xO3 film undergoes changes in optical property when an external voltage signal-is applied to the electrode. Therefore, as it passes through the KTaxNb1-xO3 film, the input optical signal is modulated by the characteristic change. The modulated optical signal is taken out as an output optical signal.

A method for manufacturing a nitride semiconductor device, comprises: epitaxially growing a semiconductor layer of a GaN-based material on the Ga surface of a GaN substrate while the GaN substrate is mounted on a substrate holder the substrate warping during the epitaxial growth so that a epitaxial deposit is deposited on the N surface of the substrate; and subjecting the N surface of the GaN substrate to vacuum suction after the epitaxial growth of the semiconductor layer; removing the epitaxial deposit from the N side of the GaN substrate after the semiconductor layer has been epitaxially grown, and before the N surface of the n-type GaN substrate is subjected to vacuum suction.

The invention provides a manufacturing method of a semiconductor device and a display device. The manufacturing method of the semiconductor device is used for processing to adopt energy beams used for a plurality of irradiating optical systems to irradiate an annealing technique of a semiconductor film. An element forming area comprising a thin film transistor forming area is arrayed to a two-dimension pattern on the semiconductor film, wherein, in the annealing technique, the area irradiated by the energy beams is divided into a signal beam irradiating area and a boundary area, each one of aplurality of the irradiating optical systems uses the energy beams to signally irradiate the signal beam irradiating area, and the boundary area is located between adjacent signal beam irradiating areas and is irradiated by the energy beams used for two irradiating optical systems which process beam irradiation of the signal beam irradiating area.