The invention discloses a
refrigeration packaging structure of an electro-absorption modulated
laser, relates to the technical field of
chip packaging, and mainly aims to ensure that the impedance of a
signal wire and a ground wire of an electro-absorption modulated
laser is 48-52 ohms and prevent the
refrigeration effect of a
semiconductor refrigerator from being influenced by heat conduction of a gold wire. The packaging structure comprises: a base; a
semiconductor cooler arranged on the base; an L-shaped
tungsten copper block, wherein the horizontal end of the L-shaped
tungsten copper block is arranged on the
semiconductor cooler; a carrier plate, wherein the carrier plate is arranged at the vertical end, the first routing end of a first
signal pin of the carrier plate is horizontally opposite to the routing end of a second
signal pin of the carrier plate through two gold threads, the first ground pin is horizontally opposite to the third ground pin through two gold threads, and the second ground pin is horizontally opposite to the fourth ground pin through two gold threads; an electro-absorption modulated
laser chip, wherein the electro-absorption modulated laser
chip is arranged on the carrier plate, one end of the electro-absorption modulated laser chip is connected with the first signal pin, and the other end of the electro-absorption modulated laser chip is connected with the third pin; a
thermistor arranged at the vertical end; a backlight monitoring
detector chip arranged at the horizontal end; and a lens cap packaged on the base.