The invention discloses a device for reducing the wire
jumping rate of
silicon rod
cutting and a
cutting method. The device comprises a
slicing machine body and an air
pipe assembly, main rollers are symmetrically arranged on the
slicing machine body, a fragment groove is formed between the two main rollers, a small roller is arranged below the fragment groove, and
diamond wires are distributed on the main rollers and the small roller; the air
pipe assembly is arranged below the main roller, the air outlets are formed in the two sides of the air
pipe assembly, when the
branch air pipes supply air, the symmetrical
air knife-like design is formed, air flow periodically cleans the wire groove of the main roller in the rotating direction of the main roller in the
cutting process,
silicon powder and other
foreign matter are prevented from being accumulated in the wire groove, and the service life of the wire groove is prolonged. According to the
diamond wire cutting method, the risks of wire
jumping and even wire breaking caused by the fact that the
diamond wire is extruded out of a wire groove by
foreign matter during high-speed cutting are avoided, the hidden danger of wire breaking caused by groove body defects is effectively made up when the diamond wire becomes thinner and thinner, and in the cutting method, points where impurities are likely to accumulate and become the hidden danger are cleaned in a targeted mode; and the influence on the diamond wire in the cutting process is avoided.