2results about How to "Easy structure processing" patented technology

The embodiment of the present disclosure relates to the semiconductor field, and provides a manufacturing method of a semiconductor structure and the semiconductor structure, which comprises the following steps: providing a first wafer, the first wafer has opposite first and second surfaces, and the first wafer has a first conductive structure, one end of the first conductive structure is located in the first wafer; performing a thinning treatment on the first wafer in a direction perpendicular to the first surface of the second surface until the thickness of the remaining first wafer reaches a preset thickness and the one end of the first conductive structure is exposed, the thinning treatment comprises at least one film layer peeling treatment, and the film layer peeling treatment comprises the following steps: performing hydrogen ion implantation on the second surface to form a hydrogen ion containing layer in the first wafer; and performing a heating treatment on the first wafer to make the hydrogen ion containing layer fall off.

The utility model relates to the field of cable installation, and discloses a sealed cable tray for ships, which comprises a lower trough body and an upper cover body that are integrally bent and formed respectively. The lower trough body comprises a bottom plate body and bottom plate side walls. The free end at the top of the bottom plate side walls is provided with a V-shaped clamping groove that is bent upward and inward. After the free end of the V-shaped clamping groove is bent outward and upward and then inward and downward, a C-shaped sealing lip is formed. The upper cover body comprises a cover plate body and cover plate side walls. The free end at the bottom end of the cover plate side walls is bent inward and downward and then outward and upward to form a C-shaped elastic buckle. After the upper cover body is installed, the C-shaped elastic buckle is clamped into the V-shaped clamping groove, and two-point pressing contact is formed between the C-shaped elastic buckle and the V-shaped clamping groove to form a double-layer seal, and a third-layer seal is formed between the C-shaped sealing lip and the inner surface of the cover plate body. This application designs the structures of the lower trough body and the upper cover body to achieve a snap connection method with a three-layer sealing effect, which has the advantages of stable connection, good sealing effect, and convenience for disassembly and assembly.