1results about How to "Improve the handling effect" patented technology

The utility model discloses a wafer piece taking handling mechanism for horizontal electroplating equipment, including the casing, two groups of handling module that symmetry sets up in the casing. The utility model discloses a handling mechanism with double handling module is designed, and the limit boss that is used to limit the movement stroke of wafer piece taking finger is set in the casing sideboard in -side of handling mechanism, and the photoelectric switch is set on its casing bottom plate, and the photoelectric induction sheet that is inductive with photoelectric switch is set on handling mechanism, can realize the double positioning detection of wafer piece taking finger position, effectively improved the positioning accuracy of wafer piece taking finger position, avoided appearing no operation, also improved wafer handling efficiency.