1results about How to "Reduce human assistance" patented technology

This invention discloses a semiconductor packaging material handling equipment, comprising: a feeding mechanism for storing materials; a picking mechanism for removing materials from the feeding mechanism; a material identification mechanism for identifying the materials picked up by the picking mechanism; a robotic arm mechanism for picking up and placing materials; a stacking mechanism for stacking materials, feeding them into an oven mechanism, and removing them from the oven mechanism; an oven mechanism for baking the materials; a buffer station for storing the baked materials; and an unloading mechanism for unloading. This invention integrates feeding, mechanical sorting, stacking, baking, and unloading into a single unit, achieving truly fully automated transmission and material handling management, reducing manual assistance during processing, and improving product processing efficiency and quality.