7 results about "Defective Component" patented technology

The invention discloses a workshop part declaration management system, and relates to the technical field of production workshop part inventory management. The workshop spare and accessory declaration management system comprises an acquisition and division unit used for analyzing data of a comprehensive production evaluation index of each part in each part type after a preset workshop production cycle is finished; the defect judgment unit is used for judging and screening production defect parts based on the comprehensive production evaluation index and a preset production evaluation interval; the maintenance analysis unit is used for analyzing the maintenance evaluation index; and the maintenance judgment unit is used for dividing maintainable defective parts and scrapped defective parts based on the maintenance evaluation indexes and a preset maintenance evaluation interval and generating a part declaration report. Each part is comprehensively analyzed through the comprehensive production evaluation indexes, so that the production quality of the parts can be accurately evaluated, and the production efficiency of the parts is improved. A comprehensive evaluation result is provided for each part type, and potential problems of the parts can be identified more comprehensively and meticulously.

The chain vector results are analyzed to identify a faulty scan chain in the circuit and a fault associated with the faulty scan chain. The scan vector results are analyzed to identify one or more faulty scan element candidates on the faulty scan chain. An analog simulation is then performed to identify a faulty component candidate of the one or more faulty scan element candidates. During the process, a component of each of the one or more faulty scan element candidates that is sensitive to a change in signal at an input of each of the one or more faulty scan element candidates may be determined. Physical failure analysis may be performed on the circuit to locate one or more defective components in the faulty component candidates.

This invention relates to the field of molded case circuit breaker (MCCB) technology, and particularly to a method and system for configuring multi-stage tripping characteristics of MCCBs. The method analyzes the current switching and transmission process of the target circuit breaker, establishes current transmission paths, and determines multiple rated current levels. Based on the current level and path, it predicts the tripping action characteristics, constructs a multi-stage tripping characteristic distribution network, and defines the tripping characteristic constraint intervals for each operating stage. It obtains the tripping component parameter distribution network, combines the distribution network and constraint intervals to identify defects, accurately locates defective tripping components and their defect severity, and performs targeted configuration optimization on the defective components based on their defect severity, generating the final optimization result. This method, through full-process modeling and quantitative analysis, achieves a closed loop from precise defect location to automatic optimization, effectively solving the problems of traditional configuration relying on experience, high trial-and-error costs, and low accuracy. It significantly improves the tripping accuracy and protection reliability of MCCBs under different operating conditions.

A maintenance assistance system comprises: a maintenance log information storage unit configured to store maintenance log information obtained by diagnosing a diagnostic target device in the past, wherein the maintenance log information comprises data from several data elements and defective component information; a priority learning unit configured to split the maintenance log information stored in the maintenance log information storage unit according to a split condition predetermined based on the data element, to learn a relationship between the data element and a defective component in the maintenance log information for each split, and to generate a priority level for the data element for each split condition;a similar case extraction unit configured to split diagnostic data for diagnosing the diagnostic target device according to the split condition and to extract a similar case, which is similar to the diagnostic data, from the maintenance log information storage unit based on a severity level of the data element associated with the split condition; and a defective component estimation unit configured to estimate a defective component of the diagnostic target device based on the similar case extracted by the similar case extraction unit.

The present invention provides a PCBA board repair device, which relates to the technical field of repair devices and includes a bottom plate, a gantry, a horizontal transfer mechanism, a second camera assembly, a solder dotting assembly, a solder scraping assembly, a defective component removal and mounting assembly, and a melting and welding assembly. The horizontal transfer mechanism is arranged on the bottom plate and includes a Y-direction, a first X-direction moving module, and a placement plate. On the placement plate, there are a carrier platform, a solder replenishing assembly, a qualified component placement table, and a first camera assembly. The second camera assembly, the solder dotting assembly, the solder scraping assembly, the defective component removal and mounting assembly, and the melting and welding assembly are arranged in sequence along the X-direction on the gantry. The second camera assembly identifies defective components, the suction nozzle of the defective component removal and mounting assembly removes the defective components, the solder scraping assembly scrapes the remaining solder paste flat, the solder dotting assembly replenishes the solder paste, and the laser of the melting and welding assembly heats and dissolves the solder paste and welds the qualified components, realizing full automation of the repair process and high repair efficiency.

The embodiments of the present disclosure relate to a method, an apparatus, a device, and a medium for determining failure effects. The method comprises receiving failure information, wherein the failure information comprises the failure type and a type identifier. Furthermore, the method comprises determining the defective components affected by the failure information based on the received failure information using a manufacturing knowledge graph, wherein the manufacturing knowledge graph serves to trace the life cycle of vehicle components. By means of the method according to the embodiments of the present disclosure, failure information can be processed quickly and efficiently using a manufacturing knowledge graph in order to determine the affected defective components and to minimize the adverse effects of failures.

The invention discloses a mainboard defect detection method and device, a defect detection system, a storage medium and a computer program product, and the method comprises the steps: pre-establishing theoretical slice point cloud data of a mainboard, comparing actual slice point cloud data of the mainboard with the theoretical slice point cloud data, determining whether the mainboard has a defect according to a comparison result, and if yes, determining that the mainboard has the defect. The defective components are used when the mainboard has defects; and if it is determined that the mainboard has the defect, sending out a prompt that the mainboard has the defect and a notice of information of the defective component. According to the scheme, whether the mainboard has defects and defective components or not can be rapidly determined, automatic detection is achieved, maintenance personnel are prevented from replacing the mainboard blindly, the maintenance efficiency of the mainboard is effectively improved, and the maintenance cost is reduced.