An IR
thermopile sensor and a method of manufacturing the same. In the IR
thermopile sensor, a substrate defines an annular first groove provided therein with a
thermal conductivity enhancement layer made of an
electrically conductive material. A plurality of
thermocouple components are spaced apart from one another above an insulating layer and a support layer extend from above the
thermal conductivity enhancement layer towards the inside of an internal annular wall of the first groove. The additionally included
thermal conductivity enhancement layer can stabilize the temperature of cold ends of the
thermocouple components and reflect IR
radiation, helping maintain cold junctions at the same temperature as the ambient temperature. Thus, a
temperature gradient can be more easily established across hot and cold ends, resulting in
improved performance. The thermal
conductivity enhancement layer can be made of a material, which is selected to make the present invention easy to implement in terms of structure. Additionally, since the only cost increase is caused by the thermal
conductivity enhancement layer, facilitating commercial large-scale production. The insulating layer is disposed between the thermal
conductivity enhancement layer and the
thermocouple components and can reduce
flicker noise in signals output from the IR
thermopile sensor.