The invention discloses a laser drilling ash removal process for HDI circuit board production, and aims to solve the problems that in the prior art, the surface of a circuit board is prone to being contaminated by dust, black carbonized residues are left on hole walls, the carbonized residues in the hole walls are difficult to clean, and the production efficiency is high. And carbonized residues and dust influence the normal use of the circuit board. The laser drilling ash removal process comprises the following steps: step 1, etching a copper foil window; 2, cleaning dust and impurities on the surface of the circuit board; 3, the circuit board is moved to a film pasting machine, and film pasting operation is completed; and 4, burning off the substrate material in the window by using laser to form the blind hole. According to the laser drilling ash removal process, by means of the design that the dry film is attached to the surface of the circuit board, cleanliness of the circuit board is guaranteed, meanwhile, drilling operation is conducted in the mode that CO2 laser and YAG laser are combined, the inner wall of a hole formed through the YAG laser is clean and free of carbonization, cleanliness of the surface of the circuit board and the interior of the hole wall is guaranteed, and normal use of the circuit board is guaranteed.