The invention relates to a novel
microstrip line packaging structure of a substrate integrated gap
waveguide. The
microstrip line packaging structure is formed by three
layers of medium plates in an adhesion mode, wherein the medium plates comprise the top layer medium plate (1), the middle layer medium plate (2) and the bottom layer medium plate (3). Periodical
metal via holes (4) are formed in the top layer medium plate (1), a
metal layer is printed on the upper surface of the top layer medium plate (1), and metallic wound patches (5) are applied to the lower surface of the top layer medium plate (1); chamfered bent
microstrip lines (8, 9, 10 and 11) are arranged on the bottom layer medium plate (3), and a
metal layer is printed on the lower surface of the bottom layer medium plate (3). A microstrip line is packaged, the problems that
irradiation loss, plane
waves and
cavity resonance exist in a traditional microstrip line are solved, and meanwhile the novel microstrip line packaging structure has the advantages of being simple in structure, small in dimension, large in
band width, low in loss, stable in structure and the like, and is easier to integrate and
machine.